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Study on the hole-wedge effect of friction pair Zhihong Hana, Shuyang LIUb School of Mechanical & Electronic Engineering,Jingdezhen ceramic Institute,Jingdezhen,33403 China aemail: handlod@sina.com, bemail: hanliuyang@sina.com Keywords: bionic friction pair; hole-wedge effect; lubrication Abstract.
The current scholars have proposed to magnetic as a lubricant, which is a multiphase colloid traditionally used for sealing and damping control, and carried some engineering practice `.
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The effect of electroless plating time on the coating performance of SiC powders Hu Ming, Zhang Yunlong, Gao Jing*, Shan Lin, Tang Lili (1-5,College of Materials Science & Engineering of Jiamusi University, Jiamusi, P.R.China, 154007) (a huming02@163.com, b*ylzhdr@126.com, c jmsdxgaojing@126.com) Key words: Electroless plating, Cu/SiCp composites, Metal coating Abstract In order to improve the interface bonding condition between Cu and SiC powders, electroless copper plating was applied to deposit a Cu coating on SiC powder.
However, the intrinsic lack of wetting between the metal matrix and ceramics reinforcement caused difficulties in the fabrication process.
The electro-less metal coatings had been applied on the ceramics powders for SiC, Al2O3, and BaTiO3[6,7].
Electroless nickel, alloy, composite and nano coatings – A critical review.Journal of Alloys and Compounds, 2013,Vol. 571(15 ): 183-204 [4].
The preparation of core–shell Al2O3/Ni composite powders by electroless plating[J].Ceramics International, 2013, Vol..39,(5): 5485-5493 [6].

The tools used in tests were solid ceramic tools with code TPGN 12 04 04.
According to Sandvik [10] the ceramic tools when used at very high speeds, making it ideal for cutting in dry machining.
Wallbank, Machining of Titanium and its alloys - A review, Proceedings of the Institution of Mechanical Engineers - Part B: Journal of Engineering Manufacture, 204 (1990) 53-60
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Vosniakos, Predicting surface roughness in machining: a review, International Journal of Machine Tools & Manufacture. 43 (2003) 833–844 [10] Sandvik, Ferramentas rotativas – fresamento, furação, madrilamento, sistemas de ferramentas, (2011), [in Portuguese]

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Reimund and U.Eckart, Future trends in production engineering: proceedings of the first conference of the german academic society for production engineering (WGP), Berlin, 2011 [4] M.
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Tan1,e 1School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Kompleks Pusat Pengajian Jejawi 2, 02600 Arau, Perlis, Malaysia. 2School of Microelectronic Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, 02600 Arau, Perlis, Malaysia.
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Mohammed6,f 1,2,3,4,5School of Mechanical Engineering, Dr.
Magnesium is one of the least heavy engineering metals, which has a density of 1740 kg/m3 [27,86,89].
[12] Saji Viswanathan S, Organic conversion coatings for magnesium and its alloys, Journal of Industrial and Engineering Chemistry 75 (2019): 20-37
"A review on pore and porosity in tissue engineering."
Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering (2022)

Kuriyagawa: To the New Frontier of Nano-Precision M4 Processes, Journal of the Japan Society for Precision Engineering, Vol.70, No.8, (2004), pp.1014-1016 (in Japanese) [2] Deng.
T : Surface integrity in electro-discharge machining, ultrasonic machining, and diamond saw cutting of ceramic composites, Ceramics International, vol.26 (2000), pp. 825-830
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Huang: Study of precision micro-holes in 0 0.05 0.1 0.15 0.2 0.25 0 200 400 600 800 1000 Amount of tool feed [m] Machining force [N] Previous electrode arrangement New electrode arrangement Fig. 13 Change of the machining force Fig. 12 Machined high-aspect-ratio micro hole borosilicate glass using micro EDM combined with micro ultrasonic vibration machining, International Journal of Machine Tools & Manufacture, 42, (2002), 1105-1112 [5] Xi-Qing Sun, T.
Syoji: Development of Micro Ultrasonic Abrasive Machining System (1st Report, Studies in Micro Ultrasonic Abrasive Machining), JSME International Journal Series C, Vol. 45, No. 2, (2002), pp.593-600 [7] T.