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As found out by El-Daly et al., the Sn-Zn and the Sn-Zn-Bi solder produce 30MPa of 45MPa of tensile strength respectively [12].
Also a solder is classified as creep resistance if the solidus temperature takes place in a low temperature as stated by Abtew et. al and is the case for this Sn-Bi solder [1,24].
A well-defined microstructure is visible for this Sn-Bi solder (Fig. 2) as similar configuration of microstructure in the study of Shen et al. and Zou et al. and this microstructure influences in producing better physical properties [7,20,31].
BHN=Fπ2D ×(D-D2-di (2) From Tables 3 and 4, the Sn-Bi solder actually produces high hardness value of which it is highly resistance to indentation by comparing the hardness of 13.0Hv of the Sn-Ag-Cu solder alloy by the study of Tsao et al.
[12] A.A.El-Daly, A.E.Hammad.

Li et al [5] used uncoated carbide K10 for high speed milling of Ti-6A1-4V.
Wang et al [6] found that at lower feed rate (0.075 mm/r) and the same depth of cut, the tool life at higher cutting speed is longer than that at lower cutting speed.
Suresh et al [9] developed statistical models and optimized by genetic algorithm.
El-Hofy, Fundamentals of Machining Processes: Conventional and Non-Conventional Processes. 1st Edition, CRC Press, Taylor and Francis Group (2007)
El-Wardany, D.

The spectral sensitivity of Al doped photodiodes increase for incident wavelength higher than 270 nm, and are very stable below.
For Al doped diodes, we measured a low dark current of 2 pA cm-2 and a spectral sensitivity of 0.03 A/W at 280 nm.
In a previous work, Watanabe and al presented a pn diode where one point of the photoresponse was invariant with temperature [6].
Hallén, « Nuclear Radiation Detectors Based on 4H-SiC p(+)-n Junction », Edited by: Okumura, H; Harima, H; Kimoto, T; et al.
El Khakani, F.

However, a large decrease in the nanoparticle size along with transforming from SnS to SnS2 is observed at 300 0C.In addition, the optical properties of al samples , including both UV-vis absorption and emission spectra showed a blue shift as the particles size decreased.
Feng et al [28] have reported that SnS2 can be formed during the synthesis of SnS, they assert that the transformation from the SnS orthorhombic phase to the SnS2 hexagonal phase, and SnS2 is obtained when the reaction is prolonged to 48h.
El-Nahass, H.M.
El-Ghamaz, Optical properties of thermally evaporated SnS thin films, Opt.

Liu et al[13] synthesized Al nanopowders by the method of electrical Al wire explosion in argon gas.
Efimov et al[14] produced Al2O3 nanopwoders by electrical Al wire explosion in air.
The peaks of Al and N are from the AlN nanopowders.
Greil, Nitridation reactions of molten Al-(Mg, Si) alloys, J.
Mironova, E.L.

Experiment Procedure The nominal composition of the master alloy was: 30%Al, 1% Cu (wt%) and balance Zinc.
The bulk Al was superheated to 850 ℃ a period time and then put Cu into the melt.
It can be seen that the microstructure of as-cast composite is composed of primary α’ phase(Black ), Zn/Al eutectics(White) and Zn/Al eutectoids (Lamellar).
The Zn/Al eutectics were distributed on the grain boundary, in Fig.1(a).
Abou El-khair, A.

Experimental Synthesis of materials Co/MAl2O3/RL was synthesized with a process modified from ref. [3]: 2.46 g NaAlO2 and 5mL rubber latex were dissolved in 30mL water, then 10mL solution containing 3.75 g Al(NO3)3·9H2O and 0.23 g Co(NO3)2·6H2O was introduced to the former dropwise under stirring.
The peaks at 1642, 3130 and 3440 cm−1 that can be attributed to the surface-adsorbed water and hydroxyl groups were observed [11].In addition, the broad peaks in the range of 400–1000cm−1 are contributions from Al–O–Al asymmetric stretching vibrations [12].
El-Bahy, M.M.

Introduction The quasicrystals were discovered by Shercthman et al, in 1984, trough the rapid solidification of an Al-Mn alloy [1,2,3].
According to the literature, early studies on the use of quasicrystalline particles Al-Cu-Fe as a reinforcement of aluminum matrix was made by Tsai el al, in 1993.
Table 1 - Effect of time and speed on the hardness of material in factorial design Samples Time [h] Speed [rpm] Hardness [GPa] Al+6%QC 2 200 31,63 Al+6%QC 2 240 26,25 Al+6%QC 3 200 22,09 Al+6%QC 3 240 24,46 The samples were sanded and cleaned with methyl alcohol to make their surfaces totally flat and clean.
Kenzari, P. et al: Philosophical Magazine Vol. 88 (2008), p. 755
CAI, et al: Surface Science Vol. 495 (2001), p. 19

J-C failure parameters are based on the study of Duan et al. [16].
El-Tamimi, T.M.
El-Hossainy, Investigating the machinability of AISI 420 stainless steel using factorial design, Mater.
Umer et al., Assessment of finite element and smoothed particles hydrodynamics methods for modeling serrated chip formation in hardened steel, Adv.
Al-Ahmari, Chip morphology predictions while machining hardened tool steel using finite element and smoothed particles hydrodynamics methods, J.

Yi et al. [12] carried out tensile tests for Sn-0.7Cu-0.05Ni dog-bone solder samples with different additions of Ge. σT is enhanced with increasing Ge content (0 to 0.1wt%) from 32 to 38 MPa.
El-Taher et al. [29] carried out tensile tests on Sn-0.7Cu with five different strain rates (10-5 to 10-3 s-1) at 25ºC.
Hasnine et al. [9] performed tensile tests on SnCu and SnCu-Ge at room temperature for 3 different strain rates (10-3 to 10-1 s-1).
Zhu et al. [30] investigated the effect of strain rate (10-5 to 10-1 s-1) on the tensile behaviour of Sn96.5Ag3.5 dog-bone samples at 25°C.
Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M., Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher