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Thus, this study aimed to present a strut strength-reduction coefficient based on the test results to predict shear strength of simple deep RC beams.
Figure of values of the load, deflection and displacement were recorded at every 0.25 mm of mid-span deflection by using data logger.
Then, the maximum principle strain was substituted into equation 1 [4] to calculate the strength reduction coefficient.
Furthermore, strength reduction coefficients of struts decreased when a/d ratio increased.
Based on the test results, the empirical relationship to estimate strength reduction coefficients of struts is shown in Fig. 6.

The fatigue data were statistically elaborated by using a log-normal distribution and are plotted in a double log scale.
Figure 2 shows the fatigue obtained fatigue data.
Cu-Be fatigue data: (a) hour-glass shaped specimens; (b) plate with central hole specimens.
Since high temperature data from the cracked material under investigation were not available (e.g.
The fatigue data are plotted in terms of averaged SED range over a control volume in Figure 3.

These plates were hot rolled at 360°C to final thicknesses of ~ 10 mm with a total reduction of 75%.
Part of these samples was subjected to subsequent cold rolled with reductions of 50 and 80% to final thicknesses of 5 and 2 mm, respectively.
The fatigue stress-number of cycles to failure curves were plotted with the data from the above tests.
The increase in the reduction of the cold rolling promotes the shear banding.
As expected, the combination of hot and cold rolling leads to a significant increase in the strength and a reduction in ductility (Fig. 2a, Table 2).

The association of these data makes it possible to highlight the important dependence existing between the residual stresses level introduced by manufacture and the aging treatments of composite materials.
After 4h and 8h of post cure, the residual stresses reduction is reduced to 20%.
On the other hand, the stresses reduction is around 10% for 2h of post cure.
Thus, after a certain time, the increase of the post cure duration does not cause any significant reduction of the residual stresses level.
However, for standard cure cycle, the reduction stresses level is very weak due to the short time post cure.

Effects of Surfactant Concentration on Step Height Reduction of SiO2 in chemical Mechanical Polishing with Ceria Slurry B.J.
The reduction in the thickness as a function of the polishing time varied with the PVP surfactant concentration in the patterned wafer.
The step height reduction rate decreases as the polishing progresses for all of the slurries.
This study also suggests that the removal rate of the patterned oxide in the surfactant added cerium oxide slurry cannot be easily predicted from the removal rate data obtained using the blanket oxide.
Shin ,The effect of CeO2 abrasive size on dishing and step height reduction of silicon oxide film in STI-CMP, Surface & Coatings Technology, Vol. 200 (2005) 1751-1754

After getting gel-coated iron powder, we can obtain Y2O3-coated iron powder through heating and deacidizing in hydrogen reduction furnace.
Fig. 1 X-ray diffraction pattern of the reduced iron powder (2) Morphology of ODS iron powder before and after reduction Fig.2 shows the SEM images of ODS iron powder before and after reduction.
Fig. 2 SEM images of ODS iron powder before and after reduction: (A), (a): before reduction (B), (b): after reduction.
The cause is the residual carbon in the reduction can form the pearlite in the process of sintering.
Samples Sintering pressure /MPa Sintering temperature /˚C Sintering time /min Relative density /% RH /HRB UTS /MPa elongation /% Pure iron powder 40 950 8 98.6 56 305 30.3 ODS iron powder 40 950 8 98 81 510 5.2 Table.1 shows the performance datas of iron powder before and after dispersion strengthening in the same SPS conditions.

Accelerometers can be adopted to indirectly measure dynamic displacement through double integration of the acquired acceleration data; however, numerical errors resulting from this approach are inevitable and they accumulate with the evolution of time.
As it is seen, the de-noised horizontal displacement is much closer to the real horizontal motion than the raw measurement data.
The measurement noise is obtained by subtracting the real motion generated by the motion simulation device from the measurement data before or after the use of adaptive filtering, i.e
(4) where presents the data before or after filtering, and presents the real displacement data.
Likewise, the maximum of the noises decreases from 9.157 mm to 7.337 mm, resulting in a 19.88% reduction.

This material was cold rolled with the reduction ratio of 50, 90 and 98% into the thin plate with thickness of about 0.5mm.
This indicates that the higher the reduction ratio is, the smaller the grain size will be.
It can be seen that data points are almost on the straight line in spite of the reduction 159 ratio.
Data points for non-heat treated (as rolled) specimen and the primary recrystallized specimens at 1273K or 1573K almost fall on a common straight line.
The level of this straight line for 98% rolled specimens is thought to be the prominent proof for the improvement of the creep properties by the existence of the cube texture, because this curve located at lower level than that expected from the data of samples with smaller reduction ratios such as 10% and 50% [4].

Full wet process for resist strip was first successfully demonstrated at 22nm structure wafer to gain 50% silicon loss reduction.
In this work, we have first demonstrated HT_SPM full wet process at LDD (light dosed doped) loop of 22nm structure wafer to gain silicon loss 50% reduction.
By all data analysis, it’s proposed that oxidation and acid-hydrolysis reaction occurred simultaneously at the surface of SiN film when HT_SPM processing on SiN film.
It’s observed oxide etch amount will increase while SPM dispense time increases, relative oxide etch amount data are shown in Figure 4.
Silicon loss reduction by full wet.

The result shows that the soil saturation degree largely affects the free field response to cyclic loading, with a decrease in soil saturation leading to a decrease in the rate of generation of excess pore-water pressure, and consequently to a reduction in the liquefaction risk.
Research conducted on unsaturated soils showed that a small reduction in the saturation degree could result in a significant increase in the liquefaction resistance of sands.
The decrease in the saturation degree causes a reduction in the liquefied zone.
The influence of the water table depth on the excess pore-water pressure at = 5.0 sec (Fig. 4) showed that the increase in leads to an important reduction in the excess pore pressure.
Fruth, VELACS Verification of liquefaction analyses by centrifuge studies laboratory testing program soil data report: Soil data report.