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Positron beam study of Co doped ZnO films prepared by PLD Ren Hongfeng1,a , Weng Huimin1,b , Ye Bangjiao1,c , Han Rongdian1 , Li Hui2 , and Gao Chuanbo1 1 Department of Modern Physics, University of Science and Technology of China, Hefei, Anhui 230026, China 2 Department of Material Science and Engineering, University of Science and Technology of China, Hefei, Anhui 230026, China a renhan@mail.ustc.edu.cn, bwenghm@ustc.edu.cn, cbjye@ustc.edu.cn Keywords: Co doped, ZnO films, Slow positron beam, Growth temperature Abstract Slow positron beam are used to study defect structures in Co doped and undoped ZnO films prepared by Pulsed Laser Deposition (PLD) at 400°C, 600°C, 700°C on c-plane sapphire.
With the benefits of positron annihilation and variable beam energy, it is a sensitive probe to detect open-volume defects in various materials such as metals, semiconductors, polymers and nanomaterials [4][5].
Slow positron beam in University of Science and Technology of China (USTC) are used in this work.
With the ability to separate information of defects in surface from inner layer as well as to provide more details about defect structures at atom level, positron beam is proved to be a powerful and sensitive tool for defects structure studies of DMS materials.
Nishitani et al., Journal of Applied Physics,Volume 90, Number 2, July 15, 2001 [7] Yan Zhao,Yijian Jiang,Yan Fang, Journal of Crystal Growth (2007) [8]Van Veen A et al., 1990, Slow Positron Beams for Solids and Surfaces ed Schultz P J et al (New York: American Institute of Physics), p171 [9] A.zubiaga, F.Tuomisto et al., Appl.

Fabrication and Characterization of Cellulose Acetate Ultrafine Fibers Containing CdTe Quantum Dots by Electrospinning Dongmei Zhao1, 2, Liguo Sun3, Mingqiang Wang3, and Jian Li1a 1 College of Material Science and Engineering, Northeast Forest University, Harbin, 150040, China. 2Department of Food and Environment Engineering, Heilongjiang East University, Harbin, 150086, China 3School of Chemical Engineering and Materials, Heilongjiang University, Harbin, 150040, China.
It was because of the adding of QDs improving the crystallinity of the material that the temperature of weight loss rised and heat-resistant capacity was enhanced for composite fibers.
It indicated that burned material was not QDs but the polymer.
Journal of Colloid and Interface Science. 347(2010), p. 215 [10] T.
Journal of Applied Polymer Science. 119(2011), p. 803 [11] Z.

＆Eng.College, Henan University of Science and Technology, Luoyang 471003, China a email: sujh@mail.haust.edu.cn b email: liuping@mail.haust.edu.cn Keywords: Cu-Cr-Sn-Zn Alloy, Lead Frame, Aging Process, Artificial Neural Network Abstract.
Cu-Cr-Sn-Zn alloy is a material for lead frames with excellent soften resistivity, press formability, electroplatability, bondability, solderability and others[4].
(No.2002AA331112) References [1] H.J.Ryu, H.K.Baik: Journal of Materials Science Vol. 35 (2000), p. 3641 [2] F.X.Huang and J.S.Ma: Scripta materialia Vol. 48 (2003), p. 97 [3] P.Liu, B.X.Kang and X.G.Cao: Materials Science and Engineering Vol.
A265 (1999), p. 262 [4] F.Rensei: Journal of the Japan Copper and Brass Research Association Vol. 27 (1988), p.109 [5] Z.Zhang and K.Friedrich: Composites Science and Technology Vol.63 (2003), p. 2029 [6] Z.

Introduction Composite materials are expanding their applications owing to high specific strength, high elastic modulus and wide tailorbility for various properties.
We can easily fabricate wide variety of composite materials.
However, composite materials exert their advantage only when applied to two-dimensional reinforcement structures.
Experimental Procedure 2.1 Materials Comercially available collagen solution (Cellmatrix Type LA，Nitta Gelatin Inc.) was used in the present experiments.
Giraud Guille, Laurence Besseaub, Raquel Martina : Journal of Biomechanics 36, (2003) [6] M.A.Karasek, M.E.Charlton: The journal of investigative dermatology, 56 ,3, (1971) [7] M.

However, these materials and their welded joints are easy to produce ductility dip cracking (DDC) which seriously threatens the safety of equipment in service.
Materials Science and Engineering A, 380, PP: 245-258, 2004. https://doi.org/10.1016/j.msea.2004.03.075 [4] Noecker F F, DuPont J N.
Welding Journal, 2(2), PP: 31s-43s, 2008
Chinese Journal of Materials Research, 33(11), PP: 801-808, 2019. https://www.cjmr.org/CN/10.11901/1005.3093.2019.094 [8] YU L, CAO R.
An investigation of ductility dip cracking in nickel-based filler materials-Part I.

The material properties are E=30KN/mm2, v=0.25, =2500Kg/m3, t=0.15m.Two cases were studied (a) the plate with four simply-supported edges (SSSS), (b) the plate with four clamped-supported edges (CCCC).
International Journal of Solids and Structures.
International Journal for Numerical Methods in Engineering.
Journal of Sound and Vibration.
Journal of Sound and Vibration, Vol. 69(3) (1980) p. 345-359

Experimental results clearly highlight the behavior of the DNA strands similar to semiconductor materials.
Introduction The study of the electronic behavior of organic compounds has led to important research on characterization of the electronic properties of biological materials.
Methods and materials DNA molecules from Boesenbergia rotunda belonging to ginger family were extracted in Institute of Biological Science (ISB), University of Malaya.
Substrate used for etching was a p-type Si wafer (orientation <100>) of diameter (150.0 ± 0.1) mm, thickness (675 ± 25) µm and a resistivity of 1 to 10 Ω-cm bought from MEMC Electronic Materials.
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Vol. 15 (1997), p. 793 [7] Kasumov, A.Y., et al., Proximity-induced superconductivity in DNA.

In order to develop the ultrasonic backscattering models for polycrystalline materials, experimental results of the correlation between the changes in attenuation coefficients and the actual microstructure of polycrystalline materials are necessary.
Rethwisch, Materials Science and Engineering: An Introduction, 9th edition, Wiley, New Jersey, USA. (2014)
Jayachitra, Influence of heat treatment on the microstructure, ultrasonic attenuation and hardness of SAF 2205 duplex stainless steel, Materials Science and Engineering A. 529 (2011) 447-451
Garcia-Vazquez, On the use of ultrasonic spectral analysis for the characterization of artificially degraded API 5L X52 steel pipeline welded joints, Materials Science and Engineering A. 550 (2012) 227-234
Noipitak, Influence of grain size and rolling direction on stress measurement by ultrasonic surface wave (part 2), Advanced Materials Research. 717 (2013) 221-226.

Introduction The need for new materials strengthens the research for efficient and flexible production chains.
In this context, reversing hot rolling has become increasingly important for the production of special steel grades [1] and lightweight materials like aluminum and magnesium alloys [2].
In reality, each process step influences the materials properties and determines the initial conditions for the next operation.
Cui, Analysis of temperature distribution in the hot plate rolling of Mg alloy by experiment and finite element method, Journal of Materials Processing Technology 225 (2015) 286–294
Mathey, Hot rolled coil property heterogeneities due to coil cooling: Impact and prediction, in: Key Engineering Materials, 2014, pp. 919–928

Diffusion controlled creep in nanostructured materials is considered for the case when grain growth occurs concurrently.
For nanocrystalline materials, diffusional plastic flow becomes the predominant plasticity mechanism.
This effect, which is particularly pronounced for nanocrystalline materials, will obviously reduce the deceleration of creep due to grain growth.
We assume that for nanostructured materials, the sink spacing d is to be identified with the average grain size R.
Summary The effect of grain growth on diffusion creep of nanostructured materials has been investigated.