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Applications and Designs of Vibration-Assisted Machining Devices Mohamed Yassin1,a*, Mohab Hossam1,b and Hassan El-Hofy1,c 1Department of Industrial Engineering and Systems Management, Egypt-Japan University of Science and Technology, Alexandria, Egypt amohamed.baraya@ejust.edu.eg, bmohab.hossam@ejust.edu.eg, chassan.elhofy@ejust.edu.eg Keywords: Hard-to-cut materials; Design; Vibration device; Vibration-Assisted Machining (VAM).
In this respect, Li et al. designed a self-vibration turning tool.
In this concern, Chern et al. used a 2D VAM device to investigate the effects of VAM on the micro-slotting of Al 6061-T6 alloy.
Amini et al. investigated drilling of Al 7075-T6 alloy using LT VAD tool.
Vibrating element Turning Milling Drilling Grinding Linear Elliptical 1 Horizontal 1 Vertical 2 Horizontal Horizontal + Vertical Under Ultrasonic Ultrasonic Range Tool Workpiece Kim et al. 1997 √ √ √ √ √ Cerniway et al. 2001 √ √ √ √ √ Chunxiang et al. 2004 √ √ √ √ √ Li et al. 2006 √ √ √ √ √ Muhammad et al. 2012 √ √ √ √ √ Zhou et al. 2016 √ √ √ √ √ Haidong et al. 2016 √ √ √ √ √ Chern et al. 2006 √ √ √ √ √ √ Shen et al. 2012 √ √ √ √ √ Zarchi et al. 2013 √ √ √ √ √ Ding et al. 2010 √ √ √ √ √ Elhami et al. 2015 √ √ √ √ √ Azarhoushang and Akbari 2006 √ √ √ √ √ Al-Budairi 2012 √ √ √ √ √ Amini et al. 2017 √ √ √ √ √ Lotfi et al. 2017 √ √ √ √ √ Zhong and Yang 2004 √ √ √ √ √ Tawakoli et al. 2008 √ √ √ √ √ Azarhoushang et al. 2011 √ √ √ √ √ Ling et al. 2010 √ √ √ √ √ Tsiakoumis 2011 √ √ √ √ √ Marojua and Jin 2017

Vol. 27(2003), p.104 [3] C.Y.Guan, J.Ma, G.F.Liu, etal: Journal of Harbin Institute of Technology (New Series), 4(2010), p.558 [4] M.Barriada-Pereira: Journal of Chromatography A, (2003), p.115 [5] D.A.Jones: Resources,Conservation and Recycling, 34(2002), p.75 [6] L.L.Bo, X.Quan, S.Chen, et al: Water Research,40(2006), p.3061 [7] N.A.Ibrahim, M.El-Hossamy, M.M.Hashem, et al: Carbohydrate Polymers, 74(2008), p.880 [8] R.X.Li, C.P.Yang, C.Hong, et al: Journal of Hazardous Materials, 167(2009), p.1028

Wardany et al. [4] used a vibration signature analysis for tool condition monitoring in drilling of cast iron proposed an on-line detection of tool failure by detecting the changes in absolute mean value and kurtosis of the vibration signal.
Qiao et al. [6] reported the use of the vibration signal and analyzing by wavelet transform methods for on-line tool condition monitoring system for micro drilling process.
This quantification is based on recurrence plot, which is a graphical tool especially suited to detect hidden dynamic patterns and nonlinearities in a given data and on recurrence analysis which is also a graphical method designed to locate hidden recurring patterns, non-stationary, and structural changes and it was introduced by Eckmann et al [10] It is possible to recreate a topologically equivalent picture of the original multidimensional system behavior by using the time series of a single observable variable, using the method of time delay [11].
El-Wardany, D.

By using a unit cell model subjected to different loading, Pidaparti et al.[5] predicted the effective material constants of the cord-rubber composites from 2D and 3D FE analyses.
In view of the nonlinear stress–strain behavior of the cord-rubber composites, Rao et al.[8] proposed a micromechanical model for the single tire belts with different cord angles by taking into consideration both the material and geometric nonlinearities.
Pidaparti et al.[6] and Kocak[4] developed a 3D micromechanical model in which the rubber material was described as a linear elastic solid, to investigated the influence of cord shape, twist, rubber modulus and thickness on the mechanical characteristics of composites.
El-Mounayri: Comp.

Date pit used in this study was collected from date processing industry at Al Hassa, Eastern Province of Saudi Arabia.
The values obtained for percentage carbon is comparable with 48.77% that was reported by Briones et al. [8] for date pits obtained from the region of Tozeur in Tunisia.
Al-Resayes, Characteristics and chemical composition of date palm (Phoenix canariensis) seeds and seed oil.
Abd El-Sayed: BioResources 4 (2009), p. 80 [14] D.

Garduque, et al. [3] have previously reported the development of hydrogel blends using sodium carboxymethyl cellulose (NaCMC), hydroxypropyl cellulose (HPC), and sodium alginate (NaAlg).
Following the procedure from Montesano, et al. [8], experimental and control setups were prepared with five soil samples filled with 5 wt% swollen hydrogels and five soil samples without hydrogels kept as control.
According to Kalhapure, et al. [4], agricultural hydrogels are capable of absorbing a minimum of 400´ its weight of water, owing to the hydrophilic groups present in the polymer chain.
References [1] NDRRMC: SitRep No. 22 re Preparedness Measures and Effects of El Niño, NDRRMC Proactive (2019)

El. 22 (2011) 158-161
Ryabtsev, et al, Determination of acetone and ethanol vapors using semiconductor sensors, J.
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Kim, et al.

References [1] Loeb GE, Richmond FJ, et al.
S. et al.
[7] El-Hamamsy S.A."
[10] Yan G, Zan P, Ye D. et al."

Furthermore, Wang et al. [17] have suggested that the β phase may act like a lubricant layer during the deformation.
Similar observation was made by Masahashi et al. [12].
Wang et al., eds., TMS, Warrendale, PA (1990), p. 465 [5] S.C.
Huang and E.L.

Hunter3,g 1Ohio Aerospace Institute/NASA Glenn Research Center, Cleveland, OH 44142, 2Auburn University, Auburn, AL 36849, 3NASA Glenn Research Center, Cleveland, OH 44135 aEmail:liangyu.chen@grc.nasa.gov, bEmail: johnsr7@auburn.edu, cEmail: neudeck@nasa.gov, dEmail:glenn.m.beheim@nasa.gov, eEmail:david.j.spry@nasa.gov, fEmail:roger.d.meredith@nasa.gov, gEmail:gary.w.hunter@nasa.gov Keywords: Packaging, SiC, high temperature, electronics, sensors Abstract: This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors, and test results of packaged SiC JFETs and capacitive pressure sensors at 500°C.
Gad-el-Hak (Eds), MEMS Design and Fabrication, The MEMS Handbook (2nd Edition), CRC Press, Boca Raton, LA, 2006.
Neudeck et al, Extreme Temperature 6H-SiC JFET Integrated Circuit Technology, Phys.
Hunter et al, Development of High Temperature SiC Based Hydrogen/Hydrocarbon Sensors with Bond Pads for Packaging, in Proc.