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Online since: June 2004
Authors: Remis Gaska, Michael S. Shur, G. Tamulaitis, I. Yilmaz, Thomas Anderson
., Pine Brook, NJ 07058, U.S.A. 4 Institute of Materials Science and Applied Research, Vilnius University, Lithuania Keywords: silicon carbide, semi-insulating SiC wafers, vanadium-doping, lifetime evaluation, lightinduced transient grating technique.
Grivickas, Materials Science Forum, Vol. 338-342 (2000), 671 [11] P.
Lindefelt, Materials Science Forum, Vol. 353-356 (2001), p. 353 [12] A.
Grivickas, Materials Science and Engineering B, Vol. 61-62 (1999,) p. 239 [13] A.
Properties of Advanced Semiconductor Materials: GaN, AlN, InN, BN, SiC and SiGe (John Wiley and Sons, New York, 2001), p. 110. 400 500 600 700 0 500 1000 1500 200 min.35 min. 14 min.
Online since: July 2023
Authors: Pratapa Suminar, Detak Yan Pratama, Sufilman Ely, Agus Muhamad Hatta, Axl Bintanis Ghafirilla Valhalla
This method uses approaches of elimination or breakdown of raw materials to yield desired materials characteristics [11].
Since structural parameters affect materials' behaviour, the study's results would favour our understanding of how material processing impacts applications.
Roy, in Transactions of the Materials Research Society of Japan, S.
Pratapa, Materials Today: Proceedings, 44, 3285–3288 (2021)
Pandey, Journal of Magnetism and Magnetic Materials, 322, 4, 400–404, (2010)
Online since: March 2026
Authors: Toochukwu С. Ogwueleka, Samson Balogun, Adeniyi G. Adeogun, Romanus Chukwukadibia Ugochukwu
Journal.
Sedimentation Study on upstream reach of Selected Rivers in Rahang River Basin Malaysia International Journal on advance Science Engineering Information Technology, 206, NO 1
International Journal of Advance Science Engineering Information Technology. 2016.
Journal of Agricultural Science Technology (2012) 14. 1637-1646
Applied Sciences, (2022)
Online since: December 2007
Authors: Kwon Su Chon, Yoshiharu Namba, Kwon Ha Yoon
It can also extend to material science, plasma fusion research, magnetic research, environmental science, and so on.
However, substrates used in SPDT are limited to non-ferrous material and plastics [1].
However, the reflecting surface, thincoated layer, of the replicated mirror is very soft: gold is a common material in the replication method.
The reflectivity of electroless nickel is much higher than that of high Z-materials, for example, gold, with the same surface roughenss.
Namba and K-H.Yoon: JSME International Journal Series C Vol. 49 (2006), p.56 [3] M.
Online since: February 2014
Authors: Rong Ge Yan, Li Hua Zhu, Zhi Juan Wang
The relatively permeability of giant magnetostrictive materials is low, and magnetic flux leakage is serious, so choose high magnetic permeability materials as yoke.
The relatively permeability of giant magnetostrictive materials is low, and magnetic flux leakage is serious, so choose high magnetic permeability materials as yoke.
C: Materials and Design.
Vol. 46 (2013), p. 617 [7] Zhang Fan, Zhixin Ma and Shang Gao: Advanced Materials Research.
Vol. 605-607 (2013), p. 1427 [8] Dehui Liu, Quanguo Lu and Dingfang Chen: Journal of Wuhan University of Technology (Transportation Science & Technology), Vol. 31, No. 4 (2007), p. 653 (In Chinese)
Online since: August 2011
Authors: Bengt Gunnar Svensson, Lasse Vines, Helge Malmbekk, Edouard V. Monakhov
Svensson1,d University of Oslo, Physics department/Center for Materials Science and Nanotechnology, P.O.
Privitera, The European physical journal.
Lewerentz, Journal of Applied Physics, 66, 1699 (1989) [9] A.A.
Istratov, Journal of Applied Physics, 82, 2965 (1997) [10] T.
Nágl, Journal of Applied Physics, 79, 3906 (1996)
Online since: October 2007
Authors: Min Qi, Xiao Na Li, Li Ying Cui
Endo:Materials Letters Vol.59(2005), p.629 [7] S.
Hono:Materials Characterization Vol.44(2000), p.101 [8] J.
Tahashi:Science and Technology of Advanced Materials Vol.4(2003), p.455 [12] X.
Yu:Journal of Material Science Vol.39(2004), p.2935 [13] M.
Mourik:materials Science and Engineering Vol.A156(1992), p.183 [15] M.
Online since: May 2012
Authors: Fatini Sidek, Anis Nurashikin Nordin, Raihan Othman
MEMS technology is an approach to fabricate that uses the materials and processes of microelectronics fabrication to form integrated mechanical microstructures.
These materials are used as structural and sacrificial layers, sensing elements and for interconnection in sensors or actuators.
In MEMS technology, most of piezoelectric thin films are polycrystalline materials.
Özgür, Zinc oxide: Fundamentals, materials and device technology: Vch Verlagsgesellschaft Mbh, 2009
Bassiri-Gharb, "Piezoelectric MEMS: Materials and Devices," Piezoelectric and Acoustic Materials for Transducer Applications, 2008
Online since: May 2012
Authors: Zhi Hui Wang, Yan Mei Gai, Cheng Gang Zhao
Fig. 3 Triangular pulse The normal stress is as follows: (4) The material parameters are listed in table 1.
Table1 Characteristic parameters of material λ/(Pa) μ/(Pa) n ρs/(kg/m3) ρf(kg/m3) ρ(kg/m3) Q/(Pa) R/(Pa) 1.72×108 1.25×108 0.26 2010 1000 1747 3.0×107 7.0×107 Conclusions By the discussion on SDAB, we have known that although SDAB is easily combined with general FE software, and can be used to analyze complex problems about the dynamic interaction between structures and soil in a fluid-saturated porous half-space, but this artifical boundary is approximate, only when the boundaries are far enough from the scatterring center, the accuracy can be satisfied.
Acknowledgments This study was carried out under the support of the Shandong Province Natural Science Foundation(Grant No.ZR2010EM043).
The Journal of Acoustical Society of America 1956;28(2):168-178
The Journal of the Acoustical Society of America 1962;34(9):1254-1264
Online since: January 2013
Authors: Xiao Liang Zhang
Acknowledgements Supported by Leading Academic Discipline Project of SMEC:J51502 and Science & Technology Fund Project in SIT:KJ2010-01, Supported by Safety Engineering leading Academic Discipline Project:A14/1020Q110010.
Current status and expected future trends indust explosion research[J], Journal of Loss Prevention in the Process Industries, 2005,18(4/5/6):225-237
Dust explosions–Cases, causes, consequences, and control[J], Journal of Hazardous Materials, 2007(140):7-44.