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Online since: September 2007
Authors: Young Moon Kim, Sung Mo Yang, Dong Pyo Hong, Gao Ping Wang, Yong Hong
Study on Fault Detection and Diagnosis of the Edge-Transmission Ball Mill System Gao-Ping Wang1, a , Yong Hong 1, b, Dong-Pyo Hong2, c , Sung-Mo Yang 1, d and Young-Moon Kim 3, e 1 Department of Precision Mechanical Engineering, Chonbuk National University, Jeonjusi Jeonbuk 561-756 South Korea 2 Department of Precision Mechanical Engineering, The Research Center of Industrial Technology, Chonbuk National University, Jeonjusi Jeonbuk 561-756 South Korea. 3 Department of Arcitectural Engineering, Chonbuk National University, Jeonjusi Jeonbuk 561-756 South Korea.
Introduction Ball mill systems are widely used in almost all building material industries, i.e. concrete, ceramic, silicate products, fireproof materials and mill run industries, etc., which play an important role in the national economy.
Acknowledgements This study is achieved as part of subject "Structure Weight-Lifting Monitoring System Development that Using Smart Material" by Ministry of Science & Technology Management International Joint Research Project and supported by NRL(National Research Laboratory) Program of MOST(Ministry of Science and Technology), MOCIE(Ministry of Commerce Industry and Energy) and also ITEP(Korea Institute of Industrial Technology Evaluation and Planning), Republic of Korea.
Journal of Vibration Engineering, 2002, 113: p491-493, Nanjing, China [2] Z.
Online since: December 2018
Authors: Willy Hermann Juimo Tchamdjou, Njarazo Rakotondrabezaharinoro, Moutari Ado
Kareem, Chemical composition and physical characteristics of rice husk ash blended cement, International Journal of Engineering Research in Africa, 32(2017) 25-35
Abidi, Effects of various amounts of natural pozzolans from volcanic scoria on performance of portland cement mortars, International Journal of Engineering Research in Africa, 32(2017) 36-52.
Martinez-Ramirez, Ceramic wastes as alternative raw materials for Portland cement clinker production, Cement & Concrete Composites, 30(2008) 798–805
Robertson, Stabilisation of tailings deposits, International experience in proceedings of mining and the environment III, Canada, 2003, pp. 25–28
Illikainen, Recycling mine tailings in chemically bonded ceramics - A review, Journal of Cleaner Production, 174(2018) 634-649
Online since: March 2013
Authors: Mohd Zainizan Sahdan, Mohamad Hafiz Mamat, Saifollah Abdullah, Norbani Abdullah, Mohamad Rusop, S. Amizam, Zuraida Khusaimi
Praserthdam, Ceramics International 34 (2008) 57-62. ].
Jimbo, Materials Science and Engineering B 127 (2006) 150-153.  ] spray pyrolysis [[14] U.
Aslan, Thin Solid Films 515 (2007) 3448–3451. ], hydrothermal [[15] Jiaqiang Xu, Yuan Zhang, Yuping Chen, Qun Xiang, Qingyi Pan, Liyi Shi, Materials Science and Engineering B 150 (2008) 55–60. ] and sol-gel [[16] M.
Zhi Lu et.al., Journal of Crystal Growth, 310 (2008) 1819-1822. ,[20] M.H.
We would also like to acknowledge Microwave Technology Centre (MTC), Faculty of Electrical Engineering (UiTM) for the usage of scanning electron microscope (SEM).
Online since: June 2015
Authors: Jing Wei Wang, Hong Yong Xie, Yu Xing Mao, Min Xu
Investigation on Dissolution of Brominated Epoxy Resin Using Ionic Liquid [Bmim]Cl from Waste Printed Circuit Boards Min XU1, a *, Jingwei WANG2,b , Yuxing MAO3,c and Hongyong XIE4,d 1School of Urban Development and Environmental Engineering, Shanghai Second Polytechnic University, Shanghai, 201209, China 2Shanghai Cooperative Centre for WEEE Recycling, Shanghai Second Polytechnic University, Shanghai, 201209, China 3School of Urban Development and Environmental Engineering, Shanghai Second Polytechnic University, Shanghai, 201209, China 4School of Urban Development and Environmental Engineering, Shanghai Second Polytechnic University, Shanghai, 201209, China axumin@sspu.edu.cn, bjwwang@sspu.edu.cn, cxmzj8825@126.com,dhyxie@sspu.edu.cn Keywords: Brominated epoxy resin; Dissolution; [Bmim]Cl; Waste printed circuit board; Abstract.Treatment technology of brominated epoxy resin (BER) is still a big challenge to waste printed circuit boards (PCBs) recycling.
Waste PCBs, a kind of high-valued electronic scrap, generally contain nearly 40% metals, 30% plastics and 30% ceramics.
Tang, et al, Dissolution and regeneration of collagen fibers using ionic liquid, International Journal of Biological Macromolecules.51 (2012) 440–448
Camino, Thermal decomposition of fire retardant brominated epoxy resins, Journal of Analytical and Applied Pyrolysis. 65 (2002) 25–40
Stigsson, On the mechanism of dissolution of cellulose, Journal of Molecular Liquids. 156 (2010) 76–81
Online since: October 2018
Authors: Mohmoud A. Abdelzaher, Ibrahim M. Ismail, Asmaa S. Hamouda, M.A. El-Sheikh
International Journal 3.6 (2015): 210-221
"Journal of Building Engineering (2018)
Journal of the American Ceramic Society 52.9 (1969):503-508
Journal of Engineering 2013 (2013)
Journal of Composite Materials, 0021998310378910.
Online since: January 2012
Authors: R. Roohibakhsh, Hekmat Razavizadeh, Hamid Reza Rezaie
Razavizadeh1,c 1Department of Metallurgical and Materials Engineering, Iran University of Science and Technology (IUST), Tehran, Iran aroya_roohi83@yahoo.com, bhrezaie@iust.ac.ir (corresponding author), chrazavizadeh@iust.ac.ir Keywords: Cu-Ni nanostructure powders, Chemical precipitation, Calcination, Reduction Abstract.
Cu-Ni powders are extensively used as electrode material in solid oxide fuel cells and base metal electrode-multilayer ceramic capacitor (BME-MLCC) [23-26].
Tepper, Metallic Nanopowders Produced by the Electro-Exploding Wire Process, International J. of Powder Metallurgy 35 (1999) 39–44
Min, Preparation of Ultrafine Nickel Powder by Polyol Method and its Oxidation Product, Materials Science and Engineering B 122 (2005) 222–225
Songping, Preparation of Ultra Fine Nickel–Copper Bimetallic Powder for BME-MLCC, Microelectronics Journal 38 (2007) 41–46
Online since: September 2013
Authors: Azwar Manaf, P. Sardjono, Rahmat Doni Widodo
As to the BHF, Strontium titanate, SrTiO3 (STO) has been widely used as advanced ceramic materials for electric and electronic applications [6].
[6] Shicheng Zhang , Jiaxiang Liu , Yuexin Han, Bingchen Chen, Xingguo Li: Materials Science and Engineering B 110 (2004), p. 11–17
[7] Wang Xuewen, Zhang Zhiyong, Zhou Shuixian: Materials Science and Engineering B 86 (2001), p. 29–33
Molaei and A.Ataie: International Journal of Modern Physics: Conference Series Vol.5 (2012), p. 519-526
Du: Journal of Magnetism and Magnetic Materials 182 (1998), p. 231
Online since: June 2014
Authors: Q.Z. Mehdi, Gurumurthy Hegde, Mohamad Ashry Bin Juusoh, Jinan B. Al-Dabbagh, Naser Mahmoud Ahmed
Worasukhkhunga, Procedia Engineering 00 (2012) 780 – 786
[6] Sung Mook Chung, Ceramics International 38S (2012) S617–S621
Alford, Journal of Applied Physics 100 (2006) 083715,1–083715,6
Zhuang, Materials Science Engineering B 134 (2006) 68–75
El-Nahass, Materials Science and Engineering B 177 (2012) 145– 150
Online since: August 2021
Authors: Roman S. Voinkov, Natalia E. Agarova, Lyubov M. Yakovleva, Konstantin L. Timofeev
Kumar, Preparation of high-purity ultrafine copper powder in mass-production by chemical reduction method: Taguchi robust design optimization, Materials Science, Powder Metallurgy and Metal Ceramics. 55 (2016) 386-396
Chigirinets, Optimization of the factors of the electrolysis process to obtain an ultrafine copper electrolytic powder, Proceedings of VII International Symposium “Surface Engineering.
Nauryzbaiev, The Effect of organic surface-active additives upon the kinetics of electrodeposition of ultrafine copper powder, Chemical Engineering Transactions. 47 (2016) 211-216
-K Mohsin, Production of copper powder from ores by electrodeposition process, Journal of University of Babylon for Engineering Sciences. 27 (2019) 233-241
Online since: April 2014
Authors: Xiao Hui Du, Shu Fen Chen, Cheng Zheng, Zhan Zhan, Jie He, Dao Heng Sun, Ling Yun Wang, Ling Ke Yu
Vertically Aligned Carbon Nanotubes Transfer with Glass Frit Jie He1,a, Zhan Zhan1,b, Xiaohui Du1,c, Shufen Chen2,d, Lingke Yu1,e, Cheng Zheng1,f, Lingyun Wang1,g* and Daoheng Sun1,h 1Dept. of Mechanical and Electrical Engineering, Xiamen Univ., Xiamen, China, 361005 2College of Chemistry and Chemical Engineering, Xiamen Univ., Xiamen, China, 361005 ahejie_579546@126.com, bzhanzhan_snow@163.com, cfengpiaotaxiang@163.com, dcsfbee36@163.com, eyulingke@gmail.com, fchzhxmu@gmail.com, gwangly@xmu.edu.cn, hsundh@xmu.edu.cn Keywords: carbon nanotubes; glass frit; transfer Abstract.
The Fig.6 (g) is a schematic diagram of device-level packaging, in which the nanogetter based on Ti films is transferred onto the kovar alloy and then they are used as lid being packaged along with the ceramic base by solder.
Acknowledgment The authors would like to thank Mingsong Lin, college of chemistry and chemical engineering, for the help about CNTs growth.
References [1] Songping Chen, Daoheng Sun, Liwei Lin, Nanogetters for MEMS hermetic packaging, Proceedings of the 7th IEEE International Conference on Nanotechnology. (2007) 921-924
Seraphin, Growing carbon nanotubes vertically and horizontally to the substrate: a review, Rangsit Journal of Arts and Sciences. 2 (2012) 161-174
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