Search results

Conclusion Based on CuPc organic semiconductor materials, we prepared an organic thin film transistor with Cu/ CuPc/ Al/ CuPc/ ITO in vertical structure.
Wang: Chemical Journal of Chinese Universities.
Xia: Journal of Shanghai University.
Zhou: Chemical Journal of Chinese Universities.
Wang: Journal of Wuyi University.

Terence Langdon, Principles of equal-channel angular pressing as a processing tool for grain refinement, Journal of Progress in Materials Science. 51 (2006) 881-981
Zehetbauer, Microstructures of nickel deformed by high pressure torsion to high strains, Journal of Materials Science Forum. 426 (2003) 2819-2824
Zhang, Annealing softening behaviour of cold-rolled low carbon steel with a dual-phase structure and resulting tensile properties, Journal of Materials Science and Engineering: A. 552 (2012) 204-210
Najafizadeh, A novel route for development of ultrahigh strength dual-phase steels, Journal of Materials Science and Engineering: A. 619 (2014) 1-11
Chatterjee, Influence of cold rolling on microstructure, texture and mechanical properties of low carbon high Mn TWIP steel, Journal of Materials Science and Engineering: A. 615 (2014) 405-415

Introduction Vacuum insulation panels l (referred to as VIP), is a new super-insulation material.It uses the principle of vacuum insulation, the insulation properties of a good core material into the trap structure, and then vacuum sealed to form the sheet.From the literature[1] to know: If the core material containing the water which can not be completely ruled out, then made use of the VIP after a period of time the vacuum will rise, insulation will deteriorate, so the pre-core material is very important.Glass fiber (a VIP core material), for example, the use of a conventional drying method to remove the core material in the water, due to very small thermal conductivity core material, the heat transfer in glass fibers is very slow, dry and long cycle, low efficiency .
Water-wet media and the general media in a certain partial pressure corresponding to a certain saturation effect of the temperature, the greater the vacuum, wet material contained in water or wet media saturation temperature corresponding to the lower boiling point temperature is low, the more easily vaporized escape leaving the material dry.Vacuum drying is based on the physical characteristics of the hot dried material which will be placed in a sealed drying chamber.
Acknowledgements:This paper is supported by Science & Technology Program of Shanghai Maritime University（20110055） References [1] Jun Ji.
High-vacuum low-temperature insulation materials.The study on TLC-VIP [D].A master's degree paper of SMU, 2007.6
[2] Xianjun Li,Qingli Wu,Wei Jiang,Biguang Zhang.The moisture migration mechanism of wood in the microwave vacuum drying process[J].Journal of Beijing Forestry University, 2006(28)

In laser induced thermal-crack propagation (LITP) cutting brittle materials, according to the laser absorption ability, materials are divided into the body absorption and surface absorption.
In recent years, the science of cutting brittle materials using LITP has attracted a significant amount of attention with many studies done to improve the machined surface characteristics and cleaving efficiency [1-6].
Tsai, Fracture Mechanism of Laser Cutting With Controlled Fracture, Journal of Manufacturing Science and Engineering, 125 (2003) 519-528
Materials Processing Technology, 155-156 (2004) 1797-1804
Materials Processing Technology, 136 (2003) 166-173

Model making uses similar materials.
Conclusion Select the appropriate physical model materials of hard brittle rock with rock burst proneness, produce a physical model of underground caverns and conduct plane strain physical model tests.
International Journal of Rock Mechanics and Mining Sciences，2003，40(5)：609–631
Chinese Journal of Rock Mechanics and Engineering，2003，22(9)：1430–1436.
Advance in Earth Sciences, 2004, 19 (3) : 451-456.

The suffix m, p and ct stand for the matrix, particulate filler materials and the composite materials respectively.
Ja¨ rvela¨, “Multi-Component Compounding of Polypropylene”, Journal of Materials Science, vol. 31, no. 14, 1996, pp. 3853–3859
Masuko, “Dynamic Viscoelastic Properties and Thermal Properties of Powder-epoxy Resin Composites”, Journal of Applied Polymer Sciences, vol. 69, 1998, pp. 2593–2598
Shembekar, “Mechanical Properties of E-glass Fibre Reinforced Nylon 6/6 Resin Composites”, Journal of Materials Science, vol. 26, 1991, pp. 6693–6698
Schmauder, „Prediction of the Failure Properties of Short Fiber Reinforced Composites with Metal and Polymer Matrix”, Computational Materials Science, vol. 28, 2003, pp. 743–748

Synergistic Effect of MgO-based Expansive Agent and Shrinkage Reducing Admixture on Compensating the Shrinkage of Cementitious Materials Zhibin Zhang 1, a, Lingling Xu 2,b and Mingshu Tang 2 1College of Biology, Chemistry and Material Science, East China Institute of Technology, NO.56 Xuefu Road, Fuzhou, P.
China 2College of Materials Science and Engineering, Nanjing University of Technology, NO.5 Xinmofan Road, Nanjing, P.
Experiments Materials.
Sarigaphuti: submitted to ACI Materials Journal (1992) [2] K.
Shah: submitted to ACI Materials Journal (1990) [4] R.B.

In microelectronic packaging processes, although resin is used as underfill materials, materials can also absorb water, or moisture, and corrosion media, it causes the corrosion.
Selvaduray, Lead-free solders in microelectronics, Materials Science and Engineering, 2000, 27:95-141
Zrineh, Electrochemical behavior of a new solder materials (Sn-In-Ag), Materials Letters, 2003, 57: 4368-4371
Pirayesh, Impression creep of the rare-earth doped Sn-2%Bi lead-free solder alloy, Journal of Materials Science: Materials in Electronics, 2010, 21(3): 262-269
Effect of bismuth and silver on the corrosion behaviour of Sn-9Zn alloy in NaCl 3 wt.% solution, Materials Science and Engineering B, 2011, 176: 1032-1036.

Introduction Practically, many kinds of composite materials are widely used in many industry fields.
Among such kinds of composite materials, SiC Particle Reinforce Aluminum Alloy (SiC PRAA) is one of the most excellent composite materials because of its many advantages.
SiC PRAA is isotropic material and overcomes some deficiencies which may occur in fiber reinforced materials.
Numerical Modeling of Multi-scale Problem Method of S-FEM was first proposed by Fish [4] and was applied to the laminated materials.
[5] Shogo Nakasumi, Katsuyuki Suzuki, Daiji Fujii and Hideomi Ohtsubo, Mixed analysis of shell and solid elements using the overlaying mesh method, J Mar Sci Technol (2003) 7:180-188 [6] Peter Kabele, Eiki Yamaguchi and Hideyuki Horii, FEM-BEM superposition method for fracture analysis of quasi-brittle structures, International Journal of Fracture 100:249-274, 1999 [7] Naoki Takano, Nasaru Zako and Manabu Ishizono, Multi-scale computational method for elastic bodies with global and local heterogeneity, Journal of computer-Aided Materials Design, 7:111-132.2000 [8] Javier Segurado, Javier LLorca, Computational micromechanics of composites: The effect of particle spatial distribution, Mechanics of Materials, 38 (2006) 873-883 [9]Zhang Ya-fang, Tang Chun-an, Yang Tian-hong, Zhang Juan-xia, Effect of Bi-Particles Geometrical Distribution on Failure Process of Brittle-Matrix Composites, Journal of Northeastern University (Natural Science), Vol.27, 926-929, 2006 [10

Therefore, only the viscoelastic materials lying between these two materials can store energy and dissipate energy as well.
Adding several kinds of functional materials with electrothermal function to concrete materials, the intelligentized concrete with the electrothermal function can be made, which can be used to get warm, deicing, snow melting, etc..
Conclusion With the rapid development of information science, life science and system science, the problems of the intellectualization of engineering materials have drawn peolple’s extensive attention.
Journal of Fuzhou University (natural sciences edtion)2005,（10）:147-150 [7] Kuang Ya-chuan, Ou Jin-ping.
Journal of Railway Science and Engineering, 2008, 5（1):6-10 [8] Wan Ze-qing.