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Materials science in semiconductor processing, 2014. 17: p. 67
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In Fig. 2(d), the adhered materials coating on the particulates contributed to the formation of large particles.
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Materials Science in Semiconductor Processing. 2015;30:9-13
Materials Science and Engineering: B. 2014;186:122-7
Journal of Materials Science. 2014;50:1958-64
Journal of Materials Science: Materials in Electronics. 2015;26:3926-32
Journal of Materials Science. 2015;50:1958-64

As edible fungus base and paper and other industrial raw materials was less than 5%.China should step up the straw in the edible fungus base and application in papermaking industrial raw materials.
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This is due to large grain size, which tends to reduce the fracture toughness and flexural strength of ceramic materials.
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The chemical composition of this material is shown in Table 1.
Acknowledgements This work was financially supported by the National Natural Science Foundation of China (51275185).
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Bonding and Integration of Silicon Carbide Based Materials for Multifunctional Applications M.
The objective was to study the bonds between different materials and to identify the optimal bonding materials and processing conditions.
Pressure* Time Atmosphere Cooling Rate Analysis [˚C] [MPa] [hr] [˚C/min] A (materials 1, 2, and 3) 1250 24, 24, 31 2 vacuum 5 microsopy & microprobe B (materials 1 and 3) 1300 24, 31 2 vacuum 2 microscopy C (materials 1 and 3) 1250 50, 50 2 vacuum 2 microscopy D (materials 1, 4 and 5) 1250 24, 31, 31 2 vacuum 2 microscopy & microprobe * at the minimun clamping pressure (except for 50 MPa), the pressure listed is with respect to the correlating material combination Table 3.
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The exploitations and experimentations with nanophase or nanostructure materials are not new.
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