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Books by Keyword: Clean
Books
Edited by:
Yoshinori Hayafuji and Xiancan Deng
Online since: September 2013
Description: Collection of selected, peer reviewed papers from the 2013 International Conference on Information Engineering for Mechanics and Materials (ICIMM 2013), July 5-7, 2013, Hangzhou, China.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 58 papers are grouped as follows:
Chapter 1: Material Science and Technologies;
Chapter 2: Research and Designing in Mechanical Engineering;
Chapter 3: Control and Intelligent Automation;
Chapter 4: Applied Computational Procedures and Information Technologies;
Chapter 5: Related Topics.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 58 papers are grouped as follows:
Chapter 1: Material Science and Technologies;
Chapter 2: Research and Designing in Mechanical Engineering;
Chapter 3: Control and Intelligent Automation;
Chapter 4: Applied Computational Procedures and Information Technologies;
Chapter 5: Related Topics.
Edited by:
Marc Heyns, Dr. Paul W. Mertens and Marc Meuris
Online since: May 2003
Description: The issues addressed by the Sixth International Symposium on the Ultra Clean Processing of Silicon Surfaces included all aspects of ultra-clean Si-technology, cleaning and contamination control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
This covered studies of Si-surface chemistry and topography and its relationship to device performance and process yield, cleaning in relationship to new gate stacks, cleaning at the interconnect level, resist stripping and polymer removal, cleaning and contamination control of various new materials, wafer backside cleaning and cleaning following Chemical-Mechanical-Polishing (CMP).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
This covered studies of Si-surface chemistry and topography and its relationship to device performance and process yield, cleaning in relationship to new gate stacks, cleaning at the interconnect level, resist stripping and polymer removal, cleaning and contamination control of various new materials, wafer backside cleaning and cleaning following Chemical-Mechanical-Polishing (CMP).
Showing 1 to 2 of 2 Books