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Books by Keyword: Damage
Books
Edited by:
Moussa Karama and Gilles Dessein
Online since: May 2013
Description: Volume is indexed by Thomson Reuters BCI (WoS).
This volume is a collecting scientific results of several researchers in the fields of prediction and handling of interactions between structure and process. Research programs have the primary objective analysis of the interactions between processes and structures in modern production facilities. This book presents the results of several interdisciplinary projects, focusing on different manufacturing processes such as high speed machining or metals forming. It contains experimental studies and mathematical modeling of production processes and the interactions of the machine. New advanced experimental and innovative simulation approaches are also included.
This volume is a collecting scientific results of several researchers in the fields of prediction and handling of interactions between structure and process. Research programs have the primary objective analysis of the interactions between processes and structures in modern production facilities. This book presents the results of several interdisciplinary projects, focusing on different manufacturing processes such as high speed machining or metals forming. It contains experimental studies and mathematical modeling of production processes and the interactions of the machine. New advanced experimental and innovative simulation approaches are also included.
Edited by:
Zdzislaw Gosiewski and Zbigniew Kulesza
Online since: March 2013
Description: Volume is indexed by Thomson Reuters BCI (WoS).
The 108 peer reviewed papers on “Mechatronic Systems and Materials” are grouped as follows:
I. Integrated Diagnostics;
II. Failure Analysis;
III. Tribology in Mechatronic Systems;
IV. Signal and Image Processing;
V. Measurement Techniques;
VI. Multifunctional and Smart Materials;
VII. Metallic Alloys;
VIII. Biomaterials;
IX. Functional Composites;
X. Nanomaterials; XI. Ceramics and Glasses;
XII. New Trends in Mechatronic and Materials Science Education.
The 108 peer reviewed papers on “Mechatronic Systems and Materials” are grouped as follows:
I. Integrated Diagnostics;
II. Failure Analysis;
III. Tribology in Mechatronic Systems;
IV. Signal and Image Processing;
V. Measurement Techniques;
VI. Multifunctional and Smart Materials;
VII. Metallic Alloys;
VIII. Biomaterials;
IX. Functional Composites;
X. Nanomaterials; XI. Ceramics and Glasses;
XII. New Trends in Mechatronic and Materials Science Education.
Edited by:
Robert V. Goldstein, Dr. Yeong-Maw Hwang, Yeau Ren Jeng and Cho-Pei Jiang
Online since: November 2012
Description: This special collection of peer-reviewed papers focuses on mechanical approaches to the experimental study and modeling of the deformation processes and defect formation accompanying various technologies.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
A series of papers was devoted to the processes of metal-forming. Special attention was paid to the question of micro- and nano-structure adjustment during processes such as extrusion and microtube press-bending. Other papers covered models for damage accumulation and healing, as well as fracture prediction during metal forming.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
A series of papers was devoted to the processes of metal-forming. Special attention was paid to the question of micro- and nano-structure adjustment during processes such as extrusion and microtube press-bending. Other papers covered models for damage accumulation and healing, as well as fracture prediction during metal forming.
Edited by:
Qing Fen Li, Yu Long Li and Prof. Ferri M.H.Aliabadi
Online since: November 2012
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This volume covers a wide range of topics: Fracture Mechanics, Failure Analysis, Composites, Multiscale Modeling, Micromechanics, Structural Health Monitoring, Damage Tolerance, Corrosion, Creep, Non-Linear Problems, Dynamic Fracture, Residual Stress, Environmental Effects, Crack Propagation, Metallic and Concrete Materials, Probabilistic Aspects, Computer Modeling Methods (Finite Element, Boundary Element and Meshless), Microstructural and Multiscale Aspects.
This volume covers a wide range of topics: Fracture Mechanics, Failure Analysis, Composites, Multiscale Modeling, Micromechanics, Structural Health Monitoring, Damage Tolerance, Corrosion, Creep, Non-Linear Problems, Dynamic Fracture, Residual Stress, Environmental Effects, Crack Propagation, Metallic and Concrete Materials, Probabilistic Aspects, Computer Modeling Methods (Finite Element, Boundary Element and Meshless), Microstructural and Multiscale Aspects.
Edited by:
Paul Mertens, Marc Meuris and Marc Heyns
Online since: April 2012
Description: The International Symposium on Ultra-Clean Processing of Semiconductor Surfaces (UCPSS) is a bi-annual conference which has been organized by IMEC since 1992.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The scope of the symposium includes all issues related to contamination, cleaning and surface preparation in mainstream large-scale Integrated Circuit manufacture. At first, silicon was typically the main semiconductor of interest. As other semiconducting materials such as SiGe, SiC, Ge and III-V compounds came under consideration for future devices, the scope was broadened so as to include these materials. Parallelling the fast-moving CMOS industry, the photovoltaic industry has also recognized the need to make improvements in cleaning. Moreover, in order to promote these semiconductor cleaning activities in PV, it was decided to add a special session focused on this topic.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The scope of the symposium includes all issues related to contamination, cleaning and surface preparation in mainstream large-scale Integrated Circuit manufacture. At first, silicon was typically the main semiconductor of interest. As other semiconducting materials such as SiGe, SiC, Ge and III-V compounds came under consideration for future devices, the scope was broadened so as to include these materials. Parallelling the fast-moving CMOS industry, the photovoltaic industry has also recognized the need to make improvements in cleaning. Moreover, in order to promote these semiconductor cleaning activities in PV, it was decided to add a special session focused on this topic.
Edited by:
Prof. Marion Merklein and Prof. Hinnerk Hagenah
Online since: February 2012
Description: This two-volume set of technical articles on materials science represents the proceedings of the Fifteenth Conference of the European Scientific Association for Material Forming held in Erlangen, Germany during March, 2012.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 227 peer-reviewed papers are grouped into the chapters: Keynotes; Formability of Metallic Materials; Forging and Rolling; Composite-Forming Processes; Semi-Solid Processes; Lightweight Design and Energy Efficiency in Metal Forming; New and Advanced Numerical Strategies for Material Forming; Extrusion and Drawing; Friction and Wear in Material Processing; Nano-Structured Materials and Microforming; Inverse Analysis Optimization and Stochastic Approaches; Constitutive Models for Metallic Alloys (Multiscale and Continuum); Innovative Joining by Forming Technologies; Incremental and Sheet-Metal Forming; Sheet-Bulk-Metal Forming; Heat Transfer Modelling; Structures, Properties and Processing of Polymers; Non-Conventional Processes; Machining and Cutting; Integrated Design, Modelling and Reliability Assessment in Forming (I-DMR).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 227 peer-reviewed papers are grouped into the chapters: Keynotes; Formability of Metallic Materials; Forging and Rolling; Composite-Forming Processes; Semi-Solid Processes; Lightweight Design and Energy Efficiency in Metal Forming; New and Advanced Numerical Strategies for Material Forming; Extrusion and Drawing; Friction and Wear in Material Processing; Nano-Structured Materials and Microforming; Inverse Analysis Optimization and Stochastic Approaches; Constitutive Models for Metallic Alloys (Multiscale and Continuum); Innovative Joining by Forming Technologies; Incremental and Sheet-Metal Forming; Sheet-Bulk-Metal Forming; Heat Transfer Modelling; Structures, Properties and Processing of Polymers; Non-Conventional Processes; Machining and Cutting; Integrated Design, Modelling and Reliability Assessment in Forming (I-DMR).
Edited by:
Ran Chen and Wen-Pei Sung
Online since: November 2011
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This book comprises 343 peer-reviewed papers on Biotechnology, Chemical and Materials Engineering, and is intended to promote the development of these subject-areas by strengthening international academic cooperation and communication, and by exchanging research ideas. This work provides readers with a broad overview of the latest advances in the fields of biotechnology and chemical and materials engineering.
This book comprises 343 peer-reviewed papers on Biotechnology, Chemical and Materials Engineering, and is intended to promote the development of these subject-areas by strengthening international academic cooperation and communication, and by exchanging research ideas. This work provides readers with a broad overview of the latest advances in the fields of biotechnology and chemical and materials engineering.
Edited by:
Z. Tonkovic and Prof. Ferri M.H.Aliabadi
Online since: September 2011
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This collection of peer-reviewed papers covers a wide range of topics: Fracture Mechanics, Failure analysis, corrosion, Creep, Non-linear problems, Dynamic Fracture, Residual Stress, Environmental effects, Crack Propagation, Repair Techniques, Composites, Ceramics, Polymers, Metallic and concrete materials, Probabilistic Aspects, Risk Analysis, Damage Tolerance, Fracture Control, Computer Modelling Methods (Finite Elements, Boundary Elements and Meshless), Microstructural and Multiscale Aspects. The work thus offers a timely survey of these subjects.
This collection of peer-reviewed papers covers a wide range of topics: Fracture Mechanics, Failure analysis, corrosion, Creep, Non-linear problems, Dynamic Fracture, Residual Stress, Environmental effects, Crack Propagation, Repair Techniques, Composites, Ceramics, Polymers, Metallic and concrete materials, Probabilistic Aspects, Risk Analysis, Damage Tolerance, Fracture Control, Computer Modelling Methods (Finite Elements, Boundary Elements and Meshless), Microstructural and Multiscale Aspects. The work thus offers a timely survey of these subjects.
Edited by:
Moussa Karama
Online since: June 2011
Description: Volume is indexed by Thomson Reuters BCI (WoS).
Original contributions to the experimental, analytical and numerical modelling of processes related to advanced materials. Research work may investigate the interactions between the manufacture (machining, forming …) and behaviour or structures of advanced materials. For damage analysis using non-destructive testing (NDT), new measurement techniques, with or without contact, and the development of new means of process control are always welcome. Improvements in the integrity of structures, cost reduction in manufacturing and increases in productivity lead, for instance, to the substitution of welding and bonding processes for mechanical assembly processes. The present-day challenge is to design and process high-quality welded and bonded joints in order to enhance the durability of assemblies. This work should thus be read by anyone wishing to keep up with the field.
Original contributions to the experimental, analytical and numerical modelling of processes related to advanced materials. Research work may investigate the interactions between the manufacture (machining, forming …) and behaviour or structures of advanced materials. For damage analysis using non-destructive testing (NDT), new measurement techniques, with or without contact, and the development of new means of process control are always welcome. Improvements in the integrity of structures, cost reduction in manufacturing and increases in productivity lead, for instance, to the substitution of welding and bonding processes for mechanical assembly processes. The present-day challenge is to design and process high-quality welded and bonded joints in order to enhance the durability of assemblies. This work should thus be read by anyone wishing to keep up with the field.
Edited by:
Helen Zhang and David Jin
Online since: June 2011
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
In this collection of peer-reviewed papers are to be found many original ideas and new angles on all aspects of Mechanical, Industrial and Manufacturing Engineering.
The work is divided into: Chapter 1: Mechanical Engineering, Design and Materials Science, Chapter 2: Materials Engineering, Industry and Manufacturing Engineering, Chapter 3: Intelligent Materials, Information Engineering and Energy Engineering, Chapter 4: Design Science, Materials and Mechanical Manufacturing Technology. A comprehensive and very current guide to the subject matter.
In this collection of peer-reviewed papers are to be found many original ideas and new angles on all aspects of Mechanical, Industrial and Manufacturing Engineering.
The work is divided into: Chapter 1: Mechanical Engineering, Design and Materials Science, Chapter 2: Materials Engineering, Industry and Manufacturing Engineering, Chapter 3: Intelligent Materials, Information Engineering and Energy Engineering, Chapter 4: Design Science, Materials and Mechanical Manufacturing Technology. A comprehensive and very current guide to the subject matter.