Deformation and Fracture in Technological Processes

Deformation and Fracture in Technological Processes

Description:

This special collection of peer-reviewed papers focuses on mechanical approaches to the experimental study and modeling of the deformation processes and defect formation accompanying various technologies.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
A series of papers was devoted to the processes of metal-forming. Special attention was paid to the question of micro- and nano-structure adjustment during processes such as extrusion and microtube press-bending. Other papers covered models for damage accumulation and healing, as well as fracture prediction during metal forming.

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Info:

Editors:
Robert V. Goldstein, Dr. Yeong-Maw Hwang, Yeau Ren Jeng and Cho-Pei Jiang
THEMA:
TQ
BISAC:
TEC021000
Details:
Special topic volume with invited peer reviewed papers only.
Pages:
224
Year:
2013
ISBN-13 (softcover):
9783037855089
ISBN-13 (CD):
9783037953167
ISBN-13 (eBook):
9783038133131
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Permissions PLS:
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Review from Ringgold Inc., ProtoView: The 17 papers focus on mechanical approaches to the experimental study and modeling of deformation processes and defect formation accompanying different technologies. One goal of the symposium was to find complementary views among the different approaches. The topics include the finite element analysis of extrusion with a two-stage die and manufacturing of gradient microstructures, some mechanical models of chemical-mechanical polishing processes, a correlation between the magnetic behavior and damage of metal materials under plastic deformations, identifying defects in an elastic body by means of the boundary measurements, a three-dimensional model of the periodic structure punch sliding upon the viscoelastic base with incompressible fluid in the contact gap, and developing an innovative algorithm for nanomechanics and using it to characterize materials.