Books by Keyword: Data Processing

Description: Collection of selected, peer reviewed papers from the 2nd International Conference on Mechanical Automation and Materials Engineering (ICMAME 2013), August 9-11, 2013, Wuhan, China.
The 167 papers are grouped as follows:
Chapter 1: Research and Design in Mechanical Engineering;
Chapter 2: Applied Computational Methods and Algorithms;
Chapter 3: Sensors, MEMS and Microengineering;
Chapter 4: Industrial Automation and Process Control;
Chapter 5: Robotics;
Chapter 6: Applied Information Technologies, Electronics and Communication Technologies;
Chapter 7: Advanced Manufacturing Technologies;
Chapter 8: Alloys, Steel Materials and Metallurgical Technologies;
Chapter 9: Chemical Materials and Chemical Engineering;
Chapter 10: Composite Materials and Technologies;
Chapter 11: Nanomaterials and Nanotechnologies;
Chapter 12: Ceramics and Functional Materials;
Chapter 13: Other Related Topics.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
These are the proceedings of the International Conference on Sport, Art Materials and Management Science (SAMMS) 2012, held on the 4 to 6th May, 2012, in Chongqing, China. The contents are divided into: Chapter 1: Technology of Materials and Chemistry; Chapter 2: Mechanical Engineering and Manufacturing Technology; Chapter 3: Mechanics, Mechatronics and Modeling.

Description: The 2011 International Conference on Information Technology for Manufacturing Systems (ITMS 2011) was co-sponsored by the University of Adelaide, Australia and Huazhong University of Science and Technology, China. Its mission was to bring together innovative academics and industrial experts in the field of Materials Science and Mechanical Science.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The proceedings consist of over 467 peer-reviewed papers which offer an uniquely up-to-date survey of the topic.

Description: This special collection on Advanced Measurement and Test is dedicated to the electronic testing of devices, boards and systems and covers the complete cycle: from design verification, design-for-testing, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement. Design, testing and yield professionals were invited to confront the challenges which the industry faces, and to learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers and test engineers.