Books by Keyword: Electronic Packaging

Description: The special edition includes articles that represented the latest research results and engineering solutions in the area of electronic device design and production. This special edition will be interesting to specialists in semiconductor power device production, microelectronics and optoelectronics.

Description: This special issue aims to provide a high level research paper for researchers, engineers and scientists to present their new advances and research results in the field of materials and innovative technologies for mechanical engineering, construction electronic packaging.

Description: Collection of selected, peer reviewed papers from the 1st International Conference on Science & Engineering of Materials 2013 (ICoSEM 2013), November 13-14, 2013, Kuala Lumpur, Malaysia.
The 61 papers are grouped as follows:
Chapter 1: Biomaterials;
Chapter 2: Catalytic Materials;
Chapter 3: Ceramics;
Chapter 4: Coating and Surface Engineering;
Chapter 5: Composites;
Chapter 6: Electronic and Electronic Packaging;
Chapter 7: Concrete and Structural Materials;
Chapter 8: Material Modeling and Simulations;
Chapter 9: Environmentally Sustainable Materials and Processing;
Chapter 10: Materials Conversion And Renewable Energy;
Chapter 11: Materials For Energy Storage;
Chapter 12: Metal and Alloys;
Chapter 13: Nanotechnology;
Chapter 14: Polymers

Description: Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structural composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for both non-structural and structural composite materials.