Engineering Research
Materials Science
Engineering Series
Books by Keyword: Finite Element Analysis (FEA)
Books
Volume is indexed by Thomson Reuters CPCI-S (WoS).
This volume comprises a collection of reviews of the latest advances in, and applications of, state-of-the-art rolling equipment and technologies. The articles are peer-reviewed, and cover a broad range of topics: advanced rolling processes, equipment and technologies for strip, plate, pipe, bar, profile and wire; special rolling equipment and technologies; advanced shearing and levelling equipment and technologies for strip, plate, pipe, bar, profile and wire; advanced testing instruments for rolling, shearing, levelling processes and rolled metal quality; advanced automatic control technologies for rolling, shearing and levelling processes; mathematical modelling and numerical simulation of rolling, shearing and levelling processes; assembly and maintenance of rolling equipment.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 477 peer-reviewed papers are grouped into 12 chapters: Session One: Computational Mechanics and Applied Mechanics, Session Two: Mechanical Design, Session Three: Materials Science and Processing, Session Four: System Dynamics and Simulation, Session Five: PC Guided Design and Manufacture, Session Six: Other Related Topics, Session Seven: Computational Mechanics and Applied Mechanics, Session Eight: Mechanical Design, Session Nine: Materials Science and Processing, Session Ten: System Dynamics and Simulation, Session Eleven: PC-Guided Design and Manufacture, Session Twelve: Other Topics. This volume thus provides an invaluable insight into the current state-of-the-art of this field.
This special volume comprises 287 expertly refereed papers. The main theme covered is Materials and Manufacturing Technology; the main goal being to provide an international scientific forum for the exchange of new ideas in a number of fields, and to facilitate in-depth interaction via discussions with peers from around the world. Core areas of Materials and Manufacturing Technology, and multi-disciplinary, inter-disciplinary and practical aspects are covered, making this essential reading for anyone interested in these topics.
This collection of peer-reviewed papers contain new research results in the field of advanced mechanical engineering. The object was to bring together researchers, development engineers and users from around the world, and from both industry and academia, in order to share state-of-art ideas for exploring new areas of research and development, and to discuss emerging issues facing advanced mechanical engineering. Workers in the field will welcome this timely coverage of the subject.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 61 papers making up this volume reflect strikingly the diverse nature of experimental mechanics. The fourteen sessions address various disciplines: e.g. aerospace, mechanical and civil engineering and state-of-the-art technologies such as biomechanics, novel sensors, and composite and cellular materials. The papers were contributed by workers in both academia and industry; with half of the contributions coming from outside of the UK: thus reflecting the international flavour of this event. This volume will be essential reading for all of those interested in the subject.
Neutron and synchrotron radiation are novel and powerful tools for stress evaluation, and are widely applied to fundamental studies in materials science and engineering, and in various industrial fields. This volume brings together the up-to-date knowledge of scientists from the academic world and industry in order to address specific topics concerning the evaluation of stresses and related phenomena using neutrons, synchrotron radiation and X-rays. Many of the presentations on stress-testing deal with samples of up to 0.5m line-pipe. Many applications of micro-beam X-ray methods are described, ranging from intragranular stress fluctuations within a grain (attributed to dislocations) to stresses in interconnects on chips. Simultaneous evaluation of tomographic and stress measurements of the same sample was shown to provide extremely clear insights into the nature and cause of damage. A major advance in the simulation of stress and strain at the mesoscopic scale has been achieved using the extended elasto-plastic self-consistent model. Such discoveries, and many others, will make this an important reference work for anyone who uses these techniques.