The primary aim of the proceeding is the combined coverage of the electronic test of devices, boards and systems—covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement at the advanced level. Such an approach enables the engineer to take into account the essential mechanical properties of the material itself and special features of practical implementation, including manufacturing technology, experimental results, and design characteristics.

Behaviour of Materials

Edited by: Moussa Karama and Joël Alexis

Online since: April 2013

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The selection of articles in this special issue is dedicated to the important topics pertaining to the understanding and determination of the mechanical behaviour of engineering materials under different regimes of loading.

Defects and Diffusion in Ceramics X

Edited by: Dr. David J. Fisher

Online since: November 2008

Description: This tenth volume in the series covering the latest results in the field includes abstracts of papers which have appeared since the publication of Annual Retrospective IX (Volume 268).