Advanced Measurement and Test III

Advanced Measurement and Test III

Description:

The primary aim of the proceeding is the combined coverage of the electronic test of devices, boards and systems—covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement at the advanced level. Such an approach enables the engineer to take into account the essential mechanical properties of the material itself and special features of practical implementation, including manufacturing technology, experimental results, and design characteristics.

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Info:

Editors:
Andy Wu
THEMA:
MB, TGB, TGM
BISAC:
TEC021000
Details:
Selected, peer reviewed papers from the 2013 3rd International Conference on Advanced Measurement and Test (AMT 2013), March 13-14, 2013, Xiamen, China
Pages:
2702
Year:
2013
ISBN-13 (softcover):
9783037857168
ISBN-13 (CD):
9783035739190
ISBN-13 (eBook):
9783038260974
Permissions CCC:
Permissions PLS:
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