Books by Keyword: Integrated Circuit Packaging

Books

Edited by: Prof. Mihail Ionescu, Prof. Tara Chandra, Prof. Christof Sommitsch and Prof. Raj Shabadi
Online since: December 2023
Description: This book presents full text peer-reviewed papers presented at the THERMEC 2023, the 12th International Conference on Processing and Manufacturing of Advanced Materials, which took place between July 03 and July 07, 2023, in Vienna, Austria, under the co-sponsorship of TU Wien and Graz University of Technology. The Conference was also under the auspices of professional organizations from Japan, Korea, France, Italy, The Netherlands, Germany, Brazil, Austria, India, and Canada. The Conference brought together researchers and engineers/technologists working in different aspects of processing, fabrication, structure/property evaluation and applications of both, ferrous and nonferrous materials including biomaterials, smart/intelligent materials as well as advanced characterisation techniques.
Edited by: Yichen Liu, Heng Yu Xu and Ying Xi Niu
Online since: October 2023
Description: Full-text papers selected by peer review from the submissions to the Asia Pacific Conference on Silicon Carbide and Related Materials (APCSRM 2022, November 14-16, 2022, Xuzhou, China) and presented in this book cover cutting-edge research on silicon carbide and related materials in the direction of materials, devices, and applications.
Edited by: Assoc. Prof. Dr. Mohd Ambri Mohamed, Dr. Dilla Duryha Berhanuddin and Azrul Azlan Hamzah
Online since: March 2022
Description:

This volume presents to readers a special collection of peer-reviewed articles related to nanomaterials and nanotechnology with the following areas: nanoelectronics; nanodevices and nanosystems; nanomaterials in medicine, renewables energy, environmental engineering, agriculture, and food technology. Selected papers were presented at the 2nd Nanotechnology Malaysia Biennial Symposium (NanoSym 2021) from 11th to 13th October 2021, Malaysia.

Edited by: Dr. Hiroshi Yano, Prof. Takeshi Ohshima, Dr. Kazuma Eto, Dr. Shinsuke Harada, Dr. Takeshi Mitani and Dr. Yasunori Tanaka
Online since: July 2020
Description: This volume contains papers from the 18th International Conference on Silicon Carbide and Related Materials 2019 (ICSCRM 2019), held in Kyoto, Japan, from September 29 through October 4, 2019. The collection reflects the results of the last research efforts on properties of silicon carbide and related materials for the goal of their use in power electronics. Presented articles, cover the wide range of topics: crystal growth and wafer manufacturing, characterization and defect engineering, MOS gate stacks and device processing, power devices, and integrated circuits packaging.
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