The presented collection “Fuel Cells” consists of some selected proceedings papers published by Trans Tech Publications Inc. within the 2017 – 2019 period. It includes a wide range of engineering solutions and results from scientific research activities in the fuel cells area.

Electronic Packaging Interconnect Technology

Edited by: Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Prof. Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Dr. Muhammad Faheem Mohd Tahir

Online since: April 2018

Description: This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.