Electronic Packaging Interconnect Technology

Electronic Packaging Interconnect Technology

Subtitle:

Electronic Packaging Interconnect Technology Symposium (EPITS 2017)

Description:

This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.

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Info:

Editors:
Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Prof. Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Dr. Muhammad Faheem Mohd Tahir
THEMA:
TDP, TGM
BISAC:
TEC008000, TEC020000, TEC021000
Details:
Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
Pages:
210
Year:
2018
ISBN-13 (softcover):
9783035713244
ISBN-13 (CD):
9783035723243
ISBN-13 (eBook):
9783035733242
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Ringgold Subjects:

Materials Science