Description: This journal volume collects peer-reviewed individual papers, describing the research results and engineering solutions, which deal with actual problems in the area of materials science, especially in polymer composites and nanomaterials. The published papers can be useful for professionals in various branches of engineering, for students and academic staff concerned with the related fields.

Electronic Packaging Interconnect Technology

Edited by: Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Prof. Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Dr. Muhammad Faheem Mohd Tahir

Online since: April 2018

Description: This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.