Description: This edition is based on the results of the 8th International Conference on Materials Sciences and Nanomaterials (ICMSN 2024) and the 8th International Conference on Advanced Manufacturing and Materials (ICAMM 2024). These two prestigious conferences, held in Edinburgh, UK, on July 9-12, 2024, brought together researchers, scientists and engineers from around the world to share their latest findings, innovations and insights on cutting-edge materials science, nanotechnology and advanced manufacturing.

Electronic Packaging Interconnect Technology

Edited by: Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Prof. Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Dr. Muhammad Faheem Mohd Tahir

Online since: April 2018

Description: This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.