Books by Keyword: Microelectronics

Description:

This special issue is the proceedings of the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014) organized by the Human Resource Cultivation Center, Gunma University, held on 5 December 2014 in Kiryu, Japan. Scopes of this proceedings are advanced materials, nanomaterials and technologies, electronics, microelectronics, photonics, biomedical engineering and some technologies of measurements in engineering.

Description: Collection of selected, peer reviewed papers from the 2014 International Conference on Intelligent Mechanics and Materials Engineering (ICIMME 2014), December 27-28, 2014, Shenzhen, China. The 378 papers are grouped as follows:
Chapter 1: Materials Science and Processing Technologies, Chemical Processes and Biotechnologies;
Chapter 2: Construction and Structural Engineering, Materials and Technologies;
Chapter 3: General Mechanical Engineering, Applied Mechanics and Manufacturing, Equipment;
Chapter 4: Measurements, Instrumentation, Testing, Monitoring, Analysis and Detection Technologies;
Chapter 5: Electronics and Microelectronics, Embedded and Integrated Systems, Communications and Signal Processing, Power and Energy, Electric and Magnetic Systems;
Chapter 6: Mechatronics, Robotics, Automation and Control

Description: Collection of selected, peer reviewed papers from the 2014 International Conference on Machine Tool Technology and Mechatronics Engineering (ICMTTME 2014), June 22-23, 2014, Guilin, Guangxi, China.
The 1440 papers are grouped as follows:
Chapter 1: Applied Mechanics, 
Chapter 2: Measurement and Instrumentation, Monitoring, Testing and Detection Technologies,
Chapter 3: Numerical Methods, Computation Methods and Algorithms for Modeling, Simulation and Optimization, Data Mining and Data Processing,
Chapter 4: Information Technologies, WEB and Networks Engineering, Information Security, Software Application and Development,
Chapter 5: Electronics and Microelectronics, Embedded and Integrated Systems, Power and Energy, Electric and Magnetic Systems,
Chapter 6: Communication, Signal and Image Processing, Data Acquisition, Identification and Recognation Technologies,
Chapter 7: Materials Processing and Manufacturing Technology, Industry Applications,
Chapter 8: Civil and Structure Engineering, Architecture Science,
Chapter 9: Bio- and Medical Applications, Chemistry Engineering, Resources and Environmental Engineering,
Chapter 10: Advanced Information and Innovative Technologies for Management, Logistics, Economics, Marketing, Education, Assessment

Description: Collection of selected, peer reviewed papers from the 2013 4^th International Conference on Advances in Materials and Manufacturing (ICAMMP 2013), 18-19 December, 2013, Kunming, China.
The 342 papers are grouped as follows:
Chapter 1: Computer-Aided Design and Research in Mechanical Engineering,
Chapter 2: Research and Design Solutions in Machinery Industry,
Chapter 3: Mathematical Modeling and Optimization in Engineering Sciences,
Chapter 4: Technology of Measurement and Signal Processing,
Chapter 5: Sensor Technology,
Chapter 6: Microelectronics, Circuit Technology and Embedded Systems,
Chapter 7: Mechatronics and Control,
Chapter 8: Technologies of Machine Vision and Identification,
Chapter 9: Industrial Robotics and Automated Manufacturing,
Chapter 10: Applied Information Technologies,
Chapter 11: Construction Technologies, Structural Strength and Reliability,
Chapter 12: Product Design,
Chapter 13: Operations and Production Management,
Chapter 14: Environmental Engineering,
Chapter 15: Multidisciplinary Engineering Education

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Collection of selected, peer reviewed papers from the 2013 International Conference on Materials Science, Machinery and Energy Engineering (MSMEE 2013), December 24-25, 2013, Hong Kong.
The 120 papers are grouped as follows:
Chapter 1: Polymer Materials and Composite Materials;
Chapter 2: Metals Materials and Building Materials;
Chapter 3: Biochemistry Materials and Engineering;
Chapter 4: Energy Science and Environmental Engineering;
Chapter 5: Manufacturing Science and Engineering;
Chapter 6: Mechatronics and Microelectronics;
Chapter 7: Computer and Internet Application

Description: Volume is indexed by Thomson Reuters BCI (WoS).
This special-topic volume, Advances in Electronic Materials, covers various fields of materials research such as silicon, silicon-germanium hetero-structures, high-k materials, III-V semiconductor alloys and organic materials, as well as nano-structures for spintronics and photovoltaics. It begins with a brief summary of the formative years of microelectronics; now the keystone of information technology.
The latter remains one of the most important global technologies, and is an extremely complex subject-area. Although electronic materials are primarily associated with computers, the internet and mobile telephones, they are used in many other applications which improve our overall quality of life. The progress made in traditional scientific fields now often depends upon new developments in electronic materials.

Description: Boron nitride thin films can be deposited on different substrates using techniques such as plasma deposition, ion beam deposition and reactive sputter deposition.