Books by Keyword: Precision Grinding

Description: This special edition focuses on scientific principles and the technologies that underpin the preparation and processing of SiC wafers. The technological operations involved in transforming a bulk SiC crystal into a device-ready substrate are described. The presented information will contribute to continued advances in manufacturing and the development of the next generation of high-performance electronic devices.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This volume presents 70 papers selected from over 100 papers submitted by university and industrial researchers. All of the papers were peer-reviewed by carefully chosen experts. This volume provides readers with a broad overview of recent advances in the field of the application of diamond and related materials, as well as brazing super-abrasives.

Description: This volume comprises a collection of papers selected from submissions made to the International Conference on Surface Finishing Technology & Surface Engineering (ICSFT2010); one of the academic conferences instigated by the Chinese Committee for Surface Finishing Technology of CMES (Chinese Mechanical Engineering Society), held in Guangzhou, China, from the 5th to 7th November, 2010. The aim of ICSFT2010 was to offer an opportunity to bring together academic researchers and industrial technologists for the purpose of exchanging information on the latest developments and applications in advanced surface engineering and surface finishing technologies, and to promote friendly and interdisciplinary research collaborations. The work offers interesting insights into the topic.