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Wafer Processing
Description:
This special edition focuses on scientific principles and the technologies that underpin the preparation and processing of SiC wafers. The technological operations involved in transforming a bulk SiC crystal into a device-ready substrate are described. The presented information will contribute to continued advances in manufacturing and the development of the next generation of high-performance electronic devices.
Purchase this book:
Print
978-3-0364-2128-5
$120.00
Info:
eBook:
ToC:
Editors:
Prof. Sang-Mo Koo and Prof. Hoon-Kyu Shin
DOI:
https://doi.org/10.4028/b-P3Il2A
DOI link
THEMA:
PDT, TJFC, TJFD
BISAC:
TEC008000, TEC020000, TEC021000
Keywords:
Basal Plane Dislocations, Cracks Propagation, Electrochemical Etching, Etching, Fixed-Abrasive Lapping, High Temperature Oxidation, Laser Slicing, Laser Splitting, Plasma Chemical Vaporisation Machining, Precision Grinding, SiC Substrate, Silicon Carbide, Surface Damage, Vertical Furnace, Wafer, Wafer Bonding, Wafer Dicing, Wafer Processing, Wafer Recycling, Water Jet Guided Laser, Wet Etching
Details:
Special topic volume with invited peer-reviewed papers only
Pages:
100
Year:
2026
ISBN-13 (softcover):
9783036421285
ISBN-13 (eBook):
9783036431284
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Ringgold Subjects:
Materials Science, Manufacturing, Electronics