Wafer Processing

Description:

This special edition focuses on scientific principles and the technologies that underpin the preparation and processing of SiC wafers. The technological operations involved in transforming a bulk SiC crystal into a device-ready substrate are described. The presented information will contribute to continued advances in manufacturing and the development of the next generation of high-performance electronic devices.

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Info:

ToC:

Table of contents

Editors:

Sang Mo Koo and Hoon Kyu Shin

DOI:

https://doi.org/10.4028/b-P3Il2A

THEMA:

PDT, TJFC, TJFD

BISAC:

TEC008000, TEC020000, TEC021000

Keywords:

Basal Plane Dislocations, Cracks Propagation, Electrochemical Etching, Etching, Fixed-Abrasive Lapping, High Temperature Oxidation, Laser Slicing, Laser Splitting, Plasma Chemical Vaporisation Machining, Precision Grinding, SiC Substrate, Silicon Carbide, Surface Damage, Vertical Furnace, Wafer, Wafer Bonding, Wafer Dicing, Wafer Processing, Wafer Recycling, Water Jet Guided Laser, Wet Etching

Details:

Special topic volume with invited peer-reviewed papers only

Pages:

100

Year:

2026

ISBN-13 (softcover):

9783036421285

ISBN-13 (eBook):

9783036431284

Ringgold Subjects:

Materials Science, Manufacturing, Electronics