Books by Keyword: Ultra Shallow Junction

Description: This second volume in a new series covering entirely general results in the fields of defects and diffusion includes 356 abstracts of papers which appeared between the end of 2009 and the end of 2010. As well as the abstracts, the volume includes original papers on theory/simulation, semiconductors and metals: “Predicting Diffusion Coefficients from First Principles …” (Mantina, Chen & Liu), “Gouge Assessment for Pipes …” (Meliani, Pluvinage & Capelle), “Simulation of the Impact Behaviour of … Hollow Sphere Structures” (Ferrano, Speich, Rimkus, Merkel & Öchsner), “Elastic-Plastic Fracture Mechanics Model …” (Liao), “Calculation of Fracture Toughness for Hydrogen Embrittlement …” (Mahdavi & Mashhadi), “… Method to Describe the Role of Diffusion in Catalyst Design” (Zeynali), “… Axial Shift and Spin Hamiltonian Parameters for Mn2+ in CdS …” (Wang, Wu, Hu & Xu), “Structure and Electronic Properties of Evaporated Thin Films of Lead Sulfide” (Ibrahim), “Acoustic Emission during Isothermal Oxidation of … Steel” (Jha, Mishra & Ojha), “… Carbon Content versus Heating Temperature in Austenitizing of Cast Iron” (Gong & Xiang), “Exploration of Parameters of Ashcroft’s Potential …” (Ghorai), Effect of Tribological Parameters upon Mechanical Wear …” (El Azizi, Meliani, Belalia & Benamar)

Description: Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.