Engineering Research
Materials Science
Engineering Series
Advances in Abrasive Technology XI
Description:
Abrasive technology concerns manufacturing processes that involve the use of abrasives in various forms. It has a long history; originating right from the first discovery of minerals. With increasingly stringent requirements for the production of high-precision and high surface-quality components, in applications such as silicon wafers for the semiconductor industry and optical lenses for the precision instrument industry, abrasive technology is becoming an increasingly important factor in precision manufacturing. An understanding of the mechanisms of abrasive technology ensures the soundness and integrity of current component manufacture, as well as leading to the development of new and effective techniques.
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Review from Ringgold Inc., ProtoView:
Abrasive technology is important in precision manufacturing applications such as silicon wafers and optical lenses. This volume collects 88 peer-reviewed papers in the field, by experts from around the world. The topics covered include new developments and applications in grinding, polishing, and abrasive machining technologies, plus novel techniques in dressing and truing for grinding processes and abrasive-jet processing. Other topics covered relevant to precision manufacturing include the nano-processing of brittle materials, precision measurements and evaluation of high-precision components, micro-fabrication, and advanced machining technologies such as ecological and high-speed machining. B&w images are included. The book will be useful as a reference for researchers in abrasive technology, and for practicing engineers in precision manufacturing. Kuriyagawa is affiliated with Tohoku University, Japan.