Materials Science and Intelligent Technologies Applications

Materials Science and Intelligent Technologies Applications

Description:

Collection of selected, peer reviewed papers from the 2014 3rd International Conference on Key Engineering Materials and Computer Science (KEMCS 2014), August 5-6, 2014, Singapore.
The 57 papers are grouped as follows:
Chapter 1: Materials Science and Materials Engineering,
Chapter 2: Artificial Intelligence and Data Mining, Data, Image and Signal Processing, Intelligent Automation and Control,
Chapter 3: Computer Science and Information Technologies,
Chapter 4: Electrical and Magnetoelectric Applications,
Chapter 5: Advanced Technologies in Social, Education, Economics, Statistics and Management Applications.

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Info:

Editors:
Khanittha Wongseedakaew and Qi Luo
THEMA:
TBC, TGB, TGM
BISAC:
TEC000000
Details:
Selected, peer reviewed papers from the 2014 3rd International Conference on Key Engineering Materials and Computer Science (KEMCS 2014), August 5-6, 2014, Singapore
Pages:
338
Year:
2014
ISBN-13 (softcover):
9783038352846
ISBN-13 (CD):
9783037959800
ISBN-13 (eBook):
9783038266686
Permissions CCC:
Permissions PLS:
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Review from Ringgold Inc., ProtoView: The 57 papers cover materials science and engineering; artificial intelligence and data mining, data, image and signal processing, intelligent automation and control; computer science and information technologies; electrical and magneto-electric applications, and advanced technologies in social, education, economics, statistics, and management applications. Among the topics are processing metal matrix nanocomponents using ultrasonic cavitation, a new protocol for the secure distributed multiplication of two polynomial shared values, a modified back propagation algorithm of a neural network with global optimization, and a bank crisis pre-warning system based on a balanced scorecard.

Ringgold Subjects:

— Artificial intelligence
— Materials science
— Robotics