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Structural and Smart Materials II
Subtitle:
4th International Conference on Mechanical Structures and Smart Materials (ICMSSM 2018)
Description:
This collection contains papers that were presented at the 4th International Conference on Mechanical Structures and Smart Materials (ICMSSM 2018), which was held on September 22-23, 2018 in Shenzhen, China. We hope this collection will be useful and interesting for engineers and researchers in the area of materials science and materials processing technologies.
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Info:
eBook:
ToC:
Editors:
Tei Woo Chiat
THEMA:
TGB, TGM
BISAC:
TEC009070, TEC021000
Keywords:
Details:
Selected, peer reviewed papers from the 4th International Conference on Mechanical Structures and Smart Materials (ICMSSM), September 22-23, 2018, Shenzhen, China.
Pages:
162
Year:
2019
ISBN-13 (softcover):
9783035712285
ISBN-13 (CD):
9783035722284
ISBN-13 (eBook):
9783035732283
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Ringgold Subjects:
Materials Science