Books by Keyword: Packaging

Description: This book consists of the selected articles by authors who participated in the 2nd International Conference on Semiconductor Materials and Technology (ICoSeMT 2021, 8-9 November 2021, Malaysia), which ensured that all manuscripts underwent a peer review process. This conference edition aimed to provide insight into the recent advancement and development in the area of optical and electronic materials, optoelectronics and electronics devices, organic and polymeric materials, and packaging technology. The structural, optical, chemical, electrical, and sensing characteristics of various types of semiconductor materials in the form of thin films and nanostructures have been reported in this book. Simulation and experimental studies regarding metal-oxide-semiconductor-based devices, high electron mobility transistors, and other devices are also presented.

Description: This collection contains papers that were presented at the 4th International Conference on Mechanical Structures and Smart Materials (ICMSSM 2018), which was held on September 22-23, 2018 in Shenzhen, China. We hope this collection will be useful and interesting for engineers and researchers in the area of materials science and materials processing technologies.

Description: The International Conference on Advanced Material Engineering & Technology (ICAMET 2015) is the premier forum for the presentation of new advances and research results in the fields of Advanced Material Engineering and Technology. This book covers the entire range of basic and applied aspects of the synthesis and characterization, modelling, processing and application of advanced engineering materials including construction materials, coating, semiconductor and biotechnology.

Description: This book is the result of twenty years of experience on the fabrication of active micro-cooling systems, the fabrication of electronic devices (radiation and magnetic sensors, transistors), the fabrication of optical devices (new green LED), and the adaptation of silicon simulation software to diamond. This includes the integration of the current transport models of diamond. The book emphasize the subjects' substrate selection, mechanical and chemical structuring, doping, and metallization. Also included is simulation as a tool to predict the results of the technological steps. Though a state of the art method is far behind in comparison to the silicon and gallium arsenide growth we assume the same state as exists in these technologies, namely that the diamond substrates are commercially available.