Paper Titles
The Use of Transient Liquid Phases in Powder Metallurgy
p.69
Austenitic Grain Size Effect on the Phase Transformation of a 7.0% Cr Steel for Forging
p.77
Evolution of Carbides during Prestrain and Tempering
p.82
Detonation Spraying of Metal Carbides Composites
p.88
How to Master Interfaces in MMCs with Reactive Constituents
p.94
Synchrotron 3D μ-Tomography of Porosity during Hot Isostatic Pressing of a Single-Crystal Nickel-Base Superalloy
p.102
Evaluation of Cu-Ni-Based Alloys for Thermoelectric Energy Conversion
p.107
Mechanical and Thermal Properties of Harmonic Structured Composites by MM/SPS Process
p.113
Time-, Temperature- and Frequency-Dependent Viscoelastic Properties of a Curing Epoxy Adhesive
p.119

How to Master Interfaces in MMCs with Reactive Constituents

Article Preview

Abstract:

It is evident that the interface in MMCs plays a crucial role with respect to thermophysical and mechanical properties of the composites. Inert systems like copper/carbon or silver/carbon will have low performance due to a very weak bonding between the constituents, whereas in reactive systems like Al/carbon, Fe(Ni)/WC and WC-Co/diamond the interfacial reaction has to be clearly controlled to avoid uncontrolled reactions. Such reactions may lead to partial or even complete dissolution of the phases and thus can have very detrimental impact on properties. In this contribution, we will summarize and present different approaches and recent results to overcome any interfacial problems. This can be either technological parameters like time, temperature, rate of consolidation, contact time in infiltration or inherent parameters like nominal composition, coatings, and surface terminations. It is of general interest to adjust optimal interfacial conditions for each application to achieve ideal properties in the composites.

You might also be interested in these eBooks
THERMEC 2021 View Preview

Info:

Periodical:

Materials Science Forum (Volume 1016)

Pages:

94-101

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.1016.94

Citation:

Cite this paper

Online since:

January 2021

Authors:

Christian Edtmaier*

Keywords:

Interface, MMC, Reactions

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2021 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

References

[1] W.B. Johnson, B. Sonuparlak, Diamond/Al metal matrix composites formed by the pressureless metal infiltration process. Journal of Materials Research, 8 (1993) 1169-1173.

DOI: 10.1557/jmr.1993.1169

Google Scholar

[2] A. Mortimer, M. Nicholas, The Wetting of Carbon by Copper and Copper Alloys. Journal of Materials Science, 5 (1970) 149-155.

DOI: 10.1007/bf00554633

Google Scholar

[3] S.M. DeVincent, in: NASA (Ed.) NASA Contractor Report 187143, Case Western Reserve University, Cleveland, Ohio, 1991, p.110.

Google Scholar

[4] Y.V. Naidich, G.A. Kolesnichenko, Study of the wetting of diamond and graphite by liquid metals. Powder Metallurgy and Metal Ceramics, 2 (1964) 35-38.

DOI: 10.1007/bf00774134

Google Scholar

[5] P.M. Scott, M. Nicholas, B. Dewar, The wetting and bonding of diamonds by copper-base binary alloys. Journal of Materials Science, 10 (1975) 1833-1840.

DOI: 10.1007/bf00754470

Google Scholar

[6] T. Schubert, Ł. Ciupiński, W. Zieliński, A. Michalski, T. Weißgärber, B. Kieback, Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications. Scripta Materialia, 58 (2008) 263-266.

DOI: 10.1016/j.scriptamat.2007.10.011

Google Scholar

[7] E. Neubauer, G. Korb, C. Eisenmenger-Sittner, H. Bangert, S. Chotikaprakhan, D. Dietzel, A.M. Mansanares, B.K. Bein, The influence of mechanical adhesion of copper coatings on carbon surfaces on the interfacial thermal contact resistance. Thin Solid Films, 433 (2003) 160-165.

DOI: 10.1016/s0040-6090(03)00318-3

Google Scholar

[8] R. Tavangar, J.M. Molina, L. Weber, Assessing predictive schemes for thermal conductivity against diamond-reinforced silver matrix composites at intermediate phase contrast. Scripta Materialia, 56 (2007) 357-360.

DOI: 10.1016/j.scriptamat.2006.11.008

Google Scholar

[9] L. Weber, R. Tavangar, On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites. Scripta Materialia, 57 (2007) 988-991.

DOI: 10.1016/j.scriptamat.2007.08.007

Google Scholar

[10] J.C. Lloyd, in: Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, 2010, p.210.

Google Scholar

[11] L. Weber, in: 20th Symposium on Composites, presentation, Vienna, (2015).

Google Scholar

[12] A.M. Abyzov, S.V. Kidalov, F.M. Shakhov, High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix. Journal of Materials Science, 46 (2011) 1424-1438.

DOI: 10.1007/s10853-010-4938-x

Google Scholar

[13] E. Neubauer, G. Kladler, C. Eisenmenger-Sittner, J. Hell, C. Prentice, P. Angerer, L. Ciupinski, Interface design in copper-diamond composite by using PVD and CVD coated diamonds. Advanced Materials Research, 59 (2009) 214-219.

DOI: 10.4028/www.scientific.net/amr.59.214

Google Scholar

[14] P.W. Ruch, O. Beffort, S. Kleiner, L. Weber, P.J. Uggowitzer, Selective interfacial bonding in Al(Si)–diamond composites and its effect on thermal conductivity. Composites Science and Technology, 66 (2006) 2677-2685.

DOI: 10.1016/j.compscitech.2006.03.016

Google Scholar

[15] C. Edtmaier, J. Segl, E. Rosenberg, G. Liedl, R. Pospichal, A. Steiger-Thirsfeld, Microstructural characterization and quantitative analysis of the interfacial carbides in Al(Si)/diamond composites. Journal of Materials Science, 53 (2018) 15514-15529.

DOI: 10.1007/s10853-018-2734-1

Google Scholar

[16] X.-G. Wang, J.R. Smith, Copper/Diamond Adhesion and Hydrogen Termination. Physical Review Letters, 87 (2001) 186103.

Google Scholar

[17] Y. Qi, L.G. Hector, Jr., Hydrogen effect on adhesion and adhesive transfer at aluminum/ diamond interfaces. Physical Review B, 68 (2003) 201403.

DOI: 10.1103/physrevb.68.201403

Google Scholar

[18] C. Monachon, L. Weber, Influence of diamond surface termination on thermal boundary conductance between Al and diamond. Journal of Applied Physics, 113 (2013) 183504-183508.

DOI: 10.1063/1.4804061

Google Scholar

[19] C. Monachon, L. Weber, Influence of diamond surface termination on thermal boundary conductance between Al and diamond. Journal of Applied Physics, 113 (2013) 183504.

DOI: 10.1063/1.4804061

Google Scholar

[20] C. Edtmaier, E. Bauer, L. Weber, Z.S. Tako, J. Segl, G. Friedbacher, Temperature dependence of the thermal boundary conductance in Ag–3Si/diamond composites. Diamond and Related Materials, 57 (2015) 37-42.

DOI: 10.1016/j.diamond.2015.01.010

Google Scholar

[21] C. Leyens, M. Peters, Titanium and Titanium Alloys: Fundamentals and Applications, Wiley, Weinheim, (2006).

Google Scholar

[22] X.-h. Lü, Y.-q. Yang, B. Huang, X. Luo, Y.-c. Liu, Reaction diffusion in continuous SiC fiber reinforced Ti matrix composite. Transactions of Nonferrous Metals Society of China, 17 (2007) 27-34.

DOI: 10.1016/s1003-6326(07)60043-0

Google Scholar

[23] B.J. Kooi, M. Kabel, A.B. Kloosterman, J.T.M. De Hosson, Reaction layers around SiC particles in Ti: an electron microscopy study. Acta Materialia, 47 (1999) 3105-3116.

DOI: 10.1016/s1359-6454(99)00151-2

Google Scholar

[24] C. Poletti, M. Balog, T. Schubert, V. Liedtke, C. Edtmaier, Production of titanium matrix composites reinforced with SiC particles. Composites Science and Technology, 68 (2008) 2171-2177.

DOI: 10.1016/j.compscitech.2008.03.018

Google Scholar

[25] C. Edtmaier, in: Proceedings of World PM2016 Congress and Exhibition, EMPA, in press, Hamburg, (2016).

Google Scholar