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HomeMaterials Science ForumMaterials Science Forum Vols. 408-412The Effect of Substrate Texture and Electroplating...

The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits

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Textures of Materials - ICOTOM 13

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Periodical:

Materials Science Forum (Volumes 408-412)

Pages:

1609-1614

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.408-412.1609

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Online since:

August 2002

Authors:

Jae Young Cho, Jerzy A. Szpunar

Keywords:

Atomic Force Microscope (AFM), Copper (Cu), Electroplating, Microstructure, Morpholoy, Orientation Image Microscopy (OIM), Texture, X-Ray

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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