Paper Titles

In Situ Particle Removal Studies Using an Optical Particle Counter
p.189

Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic
p.193

Modeling of Shock Wave Emission during Acoustically-Driven Cavitation-Induced Cleaning Processes
p.197

Ex Situ Bubble Generation, Enhancing the Particle Removal Rate for Single Wafer Megasonic Cleaning Processes
p.201

New Brush Scrubbing Techniques for a Wafer Bevel, Apex and Edge
p.205

Low Si Recess on Cleaning Process by Dilute HF/SC-1 with Megasonic
p.209

Preparation, Characterization, and Damage-Free Processing of Advanced Multiple-Gate FETs
p.213

Impact of Re-Gasified Water on Megasonic Cleaning
p.217

The Removal of Silica Particles from Micron Wide Trenches by Megasonic Cleaning
p.221

HomeSolid State PhenomenaSolid State Phenomena Vol. 134New Brush Scrubbing Techniques for a Wafer Bevel,...

New Brush Scrubbing Techniques for a Wafer Bevel, Apex and Edge

Article Preview

Abstract:

You might also be interested in these eBooks

Ultra Clean Processing of Semiconductor Surfaces VIII

Info:

Periodical:

Solid State Phenomena (Volume 134)

Pages:

205-208

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.205

Citation:

Cite this paper

Online since:

November 2007

Authors:

Hajime Ugajin, Hayato Iwamoto, Eiji Hide, Nobuyasu Hiraoka, Tsuyoshi Okumura

Keywords:

Apex, Bevel, Brush, Edge, Scrub

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2008 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: