Papers by Author: Adolf Schöner

Abstract: In 3C-SiC MOSFETs, planar defects like anti-phase boundaries (APBs) and stacking-faults (SFs) reduce the breakdown voltage and induce leakage current. Although the planar defect density can be reduced by growing 3C-SiC on undulant-Si substrate, specific type of SFs, which expose the Si-face, remains on the (001) surface. Those SFs increase the leakage current in devices made with 3C-SiC. In order to eliminate the residual SFs, an advanced SF reduction method involving polarity conversion and homo-epitaxial growth was developed. This method is called switch-back epitaxy (SBE) and consists of the conversion of the SF surface polarity from Si-face to C-face and following homo-epitaxial growth. The reduction of the SF density in SBE 3C-SiC results in a tremendous improvement of the device performance. The combination of the achieved blocking voltage with the demonstrated high current capability indicates the potential of 3C-SiC vertical MOSFETs for high and medium power electronic applications such as electric and hybrid electric vehicle (EV/HEV) motor drives.

Abstract: Selenium (Se) and tellurium (Te) ions are implanted into n-type 6H-, 4H- and 3C-SiC epilayers. Double-correlated deep level transient spectroscopy investigations reveal that both Se and Te atoms form double donors in SiC. The number of double donors observed corresponds to the number of inequivalent lattice sites of the particular SiC polytype. This observation is a strong hint that Se and Te atoms reside on lattice sites. The activation energies FEa of Te double donors are larger than the corresponding ones of Se double donors.

Abstract: Aluminum ions (Al+) were implanted at room temperature or at 500°C into n-type 4HSiC. The implantation damage (displaced Si atoms) and the electrical activation of Al+ ions (concentration of Al acceptors) were determined by Rutherford backscattering in channeling mode and Hall effect, respectively, as a function of the annealing temperature.

Abstract: A near-surface Gaussian nitrogen (N) profile is implanted into the Si- or C-face of n-/ptype 4H-SiC epilayers prior to a standard oxidation process. The corresponding MOS capacitors are investigated by conductance and internal photoemission spectroscopy. The effect of N-implantation on the density of interface traps Dit is studied and a model is proposed, which consistently explains the observed results.

Abstract: Vertical DMOSFET devices with varying size from single cell to 3x3 mm2 large devices have been realized. The investigated devices had hexagonal and square unit cell designs with 2 $m and 4 $m channel length. The p-body was aluminum implanted and the source was nitrogen or phosphorus implanted. Low temperature Ti/W contacts were evaluated.

Abstract: This paper reports the fabrication of epitaxial 4H-SiC bipolar junction transistors (BJTs) with a maximum current gain β=64 and a breakdown voltage of 1100 V. The high β value is attributed to high material quality obtained after a continuous epitaxial growth of the base-emitter junction. The current gain of the BJTs increases with increasing emitter width indicating a significant influence of surface recombination. This “emitter-size” effect is in good agreement with device simulations including recombination in interface states at the etched termination of the baseemitter junction.

Abstract: We investigate the possibility of controlling formation of stacking faults (SFs) at the interface region by implanting the 4H-SiC substrate with low-energy antimony ions (75 keV Sb+) prior to conventional CVD growth of the homoepitaxial layers. This approach is based on the solidsolution hardening concept, according to which interaction of impurity atoms with dislocations makes the motion of the latter more difficult. Photoluminescence imaging spectroscopy is employed to investigate incorporation of Sb+ implants at the buried interface and also to assess its impact on structural degradation. Spectral results are analyzed considering both the onset of n-type doping and irradiation damage. The latter factor was estimated separately from supplementary measurements of high-energy (2.5 MeV H+) proton-irradiated 4H-SiC epilayers. We compare results of optically stimulated SF formation in virgin and Sb implanted regions and provide a comprehensive picture of the defect evolution, including microscopic details of the imminent nucleation sites.

Abstract: 4H-SiC BJTs were fabricated using epitaxial regrowth instead of ion implantation to form a highly doped extrinsic base layer necessary for a good base ohmic contact. A remaining p+ regrowth spacer at the edge of the base-emitter junction is proposed to explain a low current gain of 6 for the BJTs. A breakdown voltage of 1000 V was obtained for devices with Al implanted JTE.

Abstract: Aluminium oxide and titanium oxide films were deposited using the Atomic Layer Deposition method on n-type 4H SiC and p-type Si {001} substrates, with doping 6×1015cm-3 and 2×1016cm-3, respectively, and on 1.2 kV PiN 4H SiC diodes for passivation studies. The Al2O3 and SiC interface was characterised for the existence of an effective negative charge with a density of 1×1012-2×1012 cm-2. The dielectric constant of Al2O3 as determined from capacitance-voltage data was about 8.3. The maximum electric field supported by the Al2O3 film was up to 7.5 MV/cm and 8.4 MV/cm on SiC and Si, respectively.

Abstract: A surface-near Gaussian nitrogen (N) profile is implanted into n-type 4H-SiC epilayers prior to a standard oxidation process. Depending on the depth of the oxidized layer and on the implanted N concentration, the density of interface states DIT determined in corresponding 4H-SiC MOS capacitors decreases to a minimum value of approx. 1010 cm-2eV-1 in the investigated energy range (EC-(0.1 eV to 0.6 eV)), while the flat-band voltage increases to negative values due to generated fixed positive charges. A thin surface-near layer, which is highly N-doped during the chemical vapour deposition growth, leads to a reduction of DIT only close to the conduction band edge.