Papers by Author: Gerhard Pensl

Abstract: Persistent conductivity in n-type 3C-SiC is investigated in a wide temperature range down to 3 K by Hall effect, admittance spectroscopy, low temperature photoluminescence (LTPL) and Raman spectroscopy. We propose a model, which clearly explains the persistent behavior of the electron density n below 50 K. It is experimentally verified that the persistent conductivity results from doped SF bunches, which can be considered as nanopolytype inclusions in 3C-SiC.

Abstract: Deep Level Transient Spectroscopy (DLTS) investigations at different temperatures and with various filling pulse lengths were performed on n-type 4H-SiC epitaxial layers using Iridium Schottky contacts to determine the electrical capture process of the EH₆-center. The temperature dependence of the electrical capture cross section σ ~ T^-2.0 suggests a cascade capture process, which is not thermally activated. Together with earlier work by Zippelius et al. [4] this proves the acceptor-type of the EH₆-center.

Abstract: Deep Level Transient Spectroscopy (DLTS) and Double-correlated DLTS (DDLTS) measurements have been conducted on Schottky contacts fabricated on n-type 4H-SiC epilayers using different contact metals in order to separate the EH₆- and EH₇-centers, which usually appear as a broad double peak in DLTS spectra. The activation energy of EH₆ (E_C - E_T(EH₆) = 1.203 eV) turns out to be independent of the electric field. As a consequence, EH₆ is acceptor-like according to the missing Poole-Frenkel effect. Therefore, it can be excluded that the EH₆-center and the prominent acceptor-like Z_1/2-center belong to different charge states of the same microscopic defect as theoretically suggested. It is proposed that EH₆ is a complex containing a carbon vacancy and another component available at high concentrations. The activation energy of EH₇ (E_C - E_T(EH₇) = 1.58 eV) has been evaluated indirectly by fitting the DLTS spectra of the EH_6/7 double peak taking the previously determined parameters of EH₆ into account.

Abstract: The channel mobility in 3C-SiC n-MOSFETs is investigated by current-voltage and Hall-effect measurements. For comparison, these techniques are also applied to 3C-SiC bulk rods. It turns out that the channel mobility depends on the orientation of the crystal and channel length. The observed results are traced back to the influence of Si-terminated stacking faults (Si-SFs), to the resistance of the drain/source contact and to the warping of the wafer caused by the special growth technique.

Abstract: The dependence of the reverse current of 3C-SiC p+-n diodes on the temperature and on the reverse bias is measured and a model based on thermally-assisted tunneling is proposed to explain the dominating mechanism responsible for the leakage current. Taking into account an additional ohmic shunt resistance, the experimental reverse characteristics and thermal barrier heights B can sufficiently be reproduced.

Abstract: p-type 3C-SiC samples were implanted by iron (Fe) and investigated by means of deep level transient spectroscopy (DLTS). Corresponding argon (Ar) profiles with similar implantation damage were implanted in order to distinguish between iron-related defects and defects caused by implantation damage. Two donor-like iron-related centers were identified in p-type 3C-SiC.

Abstract: Fe-implanted n-/p-type 4H-SiC samples were investigated by deep level transient spectroscopy (DLTS). In order to be able to separate Fe-related defect centers from defects caused by implantation damage, a corresponding Ar-profile was implanted. No Fe-related defects were observed in n-type 4H-SiC, while two Fe-related centers could be identified in p-type 4H-SiC. The electrical behavior of these centers is donor-like.

Abstract: Boron (B) ions were implanted into 4H-SiC. In order to avoid the out-diffusion of B ions during the subsequent annealing process, two processing techniques were applied. Either a box-shaped B-profile was implanted, which was followed by a two-step annealing (900°C for 120 min + annealing temperature TA for 30 min), or a box-shaped B-profile was implanted together with two carbon (C) Gaussian profiles located on both edges of the B box-profile followed by a one-step annealing (TA for 30 min). The annealing temperature TA ranged from 1500°C to 1750°C. The electrically activated B acceptor concentration was measured by temperature-dependent Hall effect and the energy for the formation of the B acceptor was determined assuming a first order process.

Abstract: The authors have investigated effects of thermal oxidation on deep levels in the whole energy range of bandgap of 4H-SiC which are generated by ion implantation, by deep level transient spectroscopy (DLTS). The dominant defects in n-type samples after ion implantation and high-temperature annealing at 1700oC, IN3 (Z1/2: Ec – 0.63 eV) and IN9 (EH6/7: Ec – 1.5 eV) in low-dose-implanted samples, can be remarkably reduced by oxidation at 1150oC. However, in p-type samples, the IP8 (HK4: Ev + 1.4 eV) survives and additional defects, several defects such as IP4 (HK0: Ev + 0.72 eV) appear after thermal oxidation in low-dose-implanted samples. The defects except for the IP8 center can be reduced by subsequent annealing at 1400oC. These phenomena are explained by a model that excess interstitials are generated at the oxidizing interface and diffuse into the bulk region.

Abstract: Intrinsic defects in 3C-SiC are generated by implantation of H+- and He+-ions or irra¬diation with high energy electrons. The defect parameters and the thermal stability of the observed defects are determined. The capture-cross-section of the W6-center is directly measured by variation of the filling pulse length. The charge state of the W6-center is obtained from double-correlated DLTS investigations according to the Poole-Frenkel effect.