Papers by Author: Jadwiga Bak-Misiuk

Abstract: Solid phase epitaxial regrowth (SPER) of amorphized layer in Czochralski grown silicon (Cz-Si) created by self-implantation (Si+ dose 2x1016 cm-2, energy 150 keV), subsequently annealed for 5 h at up to 1400 K under Ar pressure up to 1.4 GPa, was investigated by Secondary Ion Mass Spectrometry (SIMS) and X-ray methods. Annealing of Cz-Si:Si resulted in pressure-dependent SPER with a marked carbon and oxygen gettering within regrown region. Depth profiling of carbon and oxygen contaminants provides useful information concerning SPER in implanted single crystalline silicon.

Abstract: Creation and transformation of defects in single crystalline (001) oriented Si-Ge with about 5.6 at. % Ge content, containing oxygen interstitials, Oi’s, at 9x1017cm-3 level, were investigated, after processing for 5 h at up to 1400 K (HT) under Ar pressure to 1.1 GPa (HP), by X-ray, synchrotron, infrared and photoluminescence methods. To create nucleation centres for Oi’s precipitation, some samples were pre-annealed for 10 h at 1000 K under 105 Pa. HT-HP treatment at 1230/1400 K results in improved sample homogeneity and crystallographic perfection. HT-HP induced changes in Si-Ge are related mainly to HP-stimulated diffusivity of Ge.

Abstract: Hydrogen gettering by implantation-disturbed buried layers in oxygen-implanted silicon (Si:O, prepared by O2+ implantation at energy 200 keV and doses 1014 cm-2 and 1017 cm-2) was investigated after annealing of Si:O at up to 1570 K, also under enhanced hydrostatic pressure, up to 1.2 GPa. Depending on processing conditions, buried layers containing SiO2-x clusters and/or precipitates were formed. To produce Si:O,H, Si:O samples were subsequently treated in RF hydrogen plasma. As determined by Secondary Ion Mass Spectrometry, hydrogen was accumulated at the sample surface and within implantation-disturbed areas. It was still present in Si:O,H (D=1017 cm–2) even after subsequent annealing at up to 873 K. Hydrogen accumulation within disturbed areas of Si:O as well as of SOI can be used for recognition of defects in such structures.

Abstract: The effect of hydrostatic argon pressure equal to 105 Pa and 1.1 GPa applied to processing at up to 1270 K (HT) of Si:Cr samples prepared by Cr+ implantation (dose 1x1015 cm-2, 200 keV) into (001) oriented Czochralski silicon, has been investigated by Secondary Ion Mass Spectrometry, photoluminescence, X-ray and SQUID methods. Cr+ implantation at this energy and dosage produces amorphous silicon (a-Si) near the implanted ions range. Solid phase epitaxial re-growth (SPER) of a-Si takes place at HT. The Cr profile does not depend markedly on HP applied during processing at 723 K. Si:Cr processed at up to 723 K indicates magnetic ordering. Annealing under 105 Pa at 873 K, 1070 K and 1270 K results in a marked diffusion of Cr toward the sample surface. In the case of processing under 1.1 GPa this diffusion is less pronounced, SPER of a-Si is retarded and the a-Si/Si interface becomes enriched with Cr. The Cr concentration in Si:Cr sample processed at 1270 K under 1.1 GPa forms two distinct maxima, the deeper one at 0.35 μm depth.

Abstract: The structure studies of single crystalline silicon implanted at 340 K or 610 K with Mn+ ions (Si:Mn) and subsequently processed under atmospheric and enhanced hydrostatic pressure at up to 1270 K are reported. The defect structure was determined by an analysis of X-ray diffuse scattering around the 004 reciprocal lattice point and by electron microscopy. High resolution X-ray diffraction techniques based on the conventional source of radiation were used for this purpose. The crystal structure of Si:Mn and the Si1-xMnx precipitates in the implantation – disturbed layer were studied by synchrotron radiation diffraction in the grazing incidence geometry. Processing of Si:Mn results in crystallization of amorphous Si within the buried implantation – disturbed layer and in formation of Mn4Si7 precipitates. Structural changes are dependent both on temperature of the Si substrate at implantation and on processing parameters.

Abstract: The effect of treatment at up to 1400 K (HT) under enhanced hydrostatic pressure (HP, up to 1.2 GPa) on helium implanted single crystalline silicon (Si:He, He ion dose up to 6x1017cm-2, energy up to 300 keV) has been investigated by transmission electron microscopy, secondary ion mass spectrometry, photoluminescence and X-Ray methods. The treatment of Si:He at ≤ 920 K - HP results in a formation of buried nano-structured layers containing helium filled cavities/bubbles and numerous extended defects; many less dislocations are created at ≥ 1270 K in Si:He treated under HP. HP affects the recrystallization of amorphous Si, diffusivity of implanted He and of implantation-induced defects and thus promotes the creation of more but smaller He-filled cavities/bubbles as well as other defects near the range of implanted He+.

Abstract: Effect of hydrostatic pressure (HP) on out – annealing of defects in self – implanted silicon (Si:Si, Si+ doses 5x1016 cm-2 and 1x1017 cm-2, energies 50 keV and 160 keV), treated for 1 – 10 h at up to 1400 K (HT) under HP ≤ 1.4 GPa, has been investigated by photoluminescence, X-ray and related methods. Applied at 720 – 1270 K enhanced pressure does not affect or affects adversely Si:Si structure while at 1400 K assists in its improvement. HP – dependent transformations in Si:Si at HT are related to effect of HP on diffusion of point defects, such as silicon interstitials and vacancies produced at implantation. Out - annealing of defects in self - implanted silicon is dependent also on spatial position of damaged areas in Si substrate.

Abstract: Oxygen precipitation and creation of defects in Czochralski grown silicon with interstitial oxygen concentration 9.4·1017 cm-3, subjected to irradiation with neutrons (5 MeV, dose 1x1017 cm-2) and subsequently treated for 5 h under atmospheric and high hydrostatic pressures (HP, up to 1.1 GPa) at 1270 / 1400 K, were investigated by spectroscopic and X - Ray methods. Point defects created by neutron irradiation stimulate oxygen precipitation and creation of dislocations under HP, especially at 1270 K. The effect of pressure treatment is related to changed concentration and mobility of silicon interstitials and vacancies as well as of the VnOm – type defects.