Papers by Author: Lea Di Cioccio

Abstract: QuaSiC TM substrates can be obtained by transferring a single crystal SiC layer onto a poly SiC substrate using the Smart Cut TM technology. The structure evolution of metal bonding (W-Si silicide) layer has been investigated by Transmission Electron Microscopy and X-ray diffraction. Results indicate that the metal bonding film is made of W5Si3. The film is discontinuous and strained. Annealing releases stress at least partially.

Abstract: Modeling and simulation of the SiC growth process is sufficiently mature to be used as a training tool for engineers as well as a decision making tool, e.g. when building new process equipment or up-scaling old ones. It is possible to simulate accurately temperature and deposition distributions, as well as doping. The key of success would be the combined use of simulation, experiments and characterization in a "daily interaction". The main limitation in SiC growth modeling is the accurate knowledge of physical, thermal, radiative, chemical and electrical data for the different components of the reactor. This is the weakest link in developing completely predictive models. In addition, the link between the thermochemical history of the grown material and its structure and defects still needs further development and input of experimental data.