Papers by Author: Marc Veillerot

Abstract: Today, the use of Pods or FOUPs (Front Opening Universal Pod) in IC manufacturing leads to specific molecular contamination issues related to the enclosed environment made with porous polymers (mainly PEEK, PC and PP) that constitute these containers. Indeed, such materials are known to outgass airborne molecular contaminants (AMC), especially polymers additives [1,2]. They are also able to absorb volatile compounds present in their atmosphere coming from the connection to an equipment or from the release of wafers just processed [3,4]. As a result, a reversible outgassing of species previously trapped in plastic is possible. This is especially critical in presence of wafers sensitive to the released contaminants leading then to potential detrimental impacts. This cross-contamination scheme was clearly evidenced for volatile acids in presence of Cu layers leading to corrosion issues [4].

Abstract: In the first part of this paper, the main steps to consider in the build up of a particle measurement method on tool kit parts with a DIW/US protocol have been described. Through that methodology, measurement protocols achieving compromises between cleaning efficiency and minimal substrate erosion can be set up for tool parts. The adhesion problem of particles on a real rough substrate is then discussed solving DLVO theory equations considering physical and chemical analysis on surface and residual particles.