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Papers by Keyword: Resist Strip

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Fluid Flow and Defect Density Considerations when Drying Bumped Wafers Using Spin and Surface Tension Gradient Methods

Authors: Daniel L. Goodman, Dustin Rabideau, Mani Sobhian

Abstract: Spin rinse drying (SRD) and surface tension gradient drying (STG) are used to clean and dry wafers after wet processing. These methods are effective at removing surface fluid and fluid trapped by capillary forces in small (<1um) features. SRD and STG processes combine driven fluid flows with controlled evaporation of thin water films to leave a dry wafer with low defect density (i.e. a low number of physical particle process adders, or areas of haze or oxidation).

161

Study of Resist Strip Chemistries for Ultra Low-k/Cu Interconnect

Authors: Han Xu, Thibaut David, Yin Xu, Vlad Tarasov, Nicolas Possémé, Didier Louis

351

Study of a Metal Gate and Silicon Selective “Dry Ash Only” Process for Combined Extension and Halo Implanted Photo Resist

Authors: G. Mannaert, Mikhail R. Baklanov, D. Goossens, Johann Vertommen, Werner Boullart

113

Qualification of Resist Strip Process for Ultra Low-k/Cu Interconnect

Authors: Han Xu, Amy Shen, Vlad Tarasov, Brian White, Josh Wolf

345

Activated He:H₂ Strip of Photoresist over Porous Low-k Materials

Authors: Qing Yuan Han, Brian White, Ivan L. Berry, Carlo Waldfried, O. Escorcia

341

Resist Strip and Cu Diffusion Barrier Etch in Cu BEOL Integration Schemes in a Mattson Highlands^TM Chamber

Authors: G. Mannaert, Marc Van Cauwenberghe, M. Schmidt, Jan Van Aelst, D. Hendrickx, M. Stucchi, Thierry Conard, Serge Vanhaelemeersch, Werner Boullart

267

Accelerated Removal of Photoresist for Semiconductor Production by an Increased-Pressure Ozone and Water Vapor Process

Authors: Glenn W. Gale, Takayuki Toshima, Naoki Shindo, Tadashi Iino, Shigenori Kitahara, Keji Taguchi

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