Authors: Mark A. Fanton, Qiang Li, A.Y. Polyakov, R.L. Cavalero, R.G Ray, B.E. Weiland, Marek Skowronski
Abstract: The effects of H2 addition to the growth ambient during physical vapor transport
(PVT) growth of 6H and 4H SiC were investigated using SIMS, DLTS and Hall effect
measurements. Using this hybrid physical-chemical vapor transport (HPVT) approach, boules were
grown using Ar-H2 and He-H2 mixtures with H2 concentrations up to 50 at%. Thermodynamic
modeling suggests that addition of H2 improves the carbon transport in HPVT compared to standard
PVT. This should lead to a substantial decrease in the concentration of residual N donors and the
concentration of electron traps. This is confirmed by the experimental results. As expected, the
source transport rate increased as H2 was added to the growth environment due to increased C
transport. The background nitrogen concentration and the free electron density decreased
significantly with increasing H2 concentration. The formation of electron traps (activation energies
of 0.4 eV, 0.6-0.65 eV, 0.7 eV, 0.9 eV and 1 eV) was also strongly suppressed. These changes were
observed for H2 concentrations as low as 4 at%. The decreased N concentration improves the
ability to produce high resistivity SiC material, and for H2 concentrations as high as 10-25%, the
very first wafers cut from the seed end of the boules have a resistivity exceeding 106 cm.
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Authors: A. Gupta, E. Semenas, Ejiro Emorhokpor, J. Chen, Ilya Zwieback, Andrew E. Souzis, Thomas Anderson
Abstract: Over the past year, II-VI has transitioned from 2” to 3” commercial SiC
substrates. Large-diameter semi-insulating 6H-SiC and n-type 4H-SiC single crystals are
grown using the Advanced PVT growth process. Expansion of boule diameter from 2 to 3
and up to 4.25 inches has been carried out using a specially designed growth technique.
Stable semi-insulating properties in 6H-SiC are achieved by precise vanadium compensation.
The technique of compensation is optimized to produce a controlled and spatially uniform
distribution of vanadium and high and spatially uniform electrical resistivity reaching 10
10
–
1011 ·cm. N-type 3-inch 4H-SiC crystals are grown using doping with nitrogen, and 3-inch
4H-SiC substrates show uniform resistivity of about 0.018 ·cm. The best quality semiinsulating
(SI) 3” 6H-SiC substrates demonstrate micropipe density of 3 cm-2, and n-type 3”
4H-SiC substrates - about 1 cm-2. X-ray rocking curve topography of the produced 3” SiC
substrates is used for evaluation of their crystal quality.
43
Authors: Thomas Anderson, Donovan L. Barrett, J. Chen, Ejiro Emorhokpor, A. Gupta, R.H. Hopkins, Andrew E. Souzis, C.D. Tanner, Murugesu Yoganathan, Ilya Zwieback
Abstract: II-VI has developed an Advanced PVT (APVT) process for the growth of
nominally undoped (vanadium-free) semi-insulating 2” and 3” diameter 6H-SiC crystals with room temperature resistivity up to 1010 W·cm. The process utilizes high-purity SiC source and employs special measures aimed at the reduction of the impurity background. The APVT-grown material demonstrates concentrations of B and N reduced to about 2·1015cm-3. Wafer resistivity has been studied and correlated with Schottky barrier capacitance, yielding the density of deep compensating centers in 6H-SiC in the low 1015 cm-3 range for both ntype
and p-type material. The nearly equal density of deep donors and deep acceptors
ndicates that the centers responsible for the intrinsic compensation can be amphoteric. TheEPR density of spins from free carbon vacancies is about 1014 cm-3. It is also hypothesized that impurity-vacancy complexes can be present in the undoped material and participate in compensation.
35
Authors: Thomas Anderson, Donovan L. Barrett, J. Chen, Ejiro Emorhokpor, A. Gupta, R.H. Hopkins, Andrew E. Souzis, C.D. Tanner, Murugesu Yoganathan, Ilya Zwieback, Wolfgang J. Choyke, Robert P. Devaty, Fei Yan
Abstract: Semi-insulating 6H SiC substrates, 2”, 3” and 100mm in diameter, and n+ 4H SiC
substrates, 2” and 3” in diameter, are grown at II-VI using the Advanced Physical Vapor Transport (APVT) technique [1]. The process utilizes high-purity SiC source and employs special measures aimed at the reduction of background contamination. Semi-insulating properties are achieved by precise vanadium compensation, which yields substrates with stable and uniform electrical resistivity reaching ~ 1011 Ω-cm and higher. Conductive n+ 4H SiC crystals with the spatially uniform resistivity of 0.02 W-cm are grown using nitrogen doping. Crystal quality of the substrates, their electrical properties and low temperature
photoluminescence are discussed.
9
Authors: Edward M. Sanchez, J. Wan, Shao Ping Wang, Mark J. Loboda, Can Hua Li, Marek Skowronski
669
Authors: Mary Ellen Zvanut, V.V. Konovalov, W.C. Mitchel, William D. Mitchell
489
Authors: W.E. Carlos, E.R. Glaser, B.V. Shanabrook
461
Authors: Nguyen Tien Son, Björn Magnusson, Z. Zolnai, Alexsandre Ellison, Erik Janzén
437
Authors: M. Fanton, Marek Skowronski, David Snyder, Hun Jae Chung, Saurav Nigam, B. Weiland, Sung Wook Huh
87
Authors: Thomas Anderson, Donovan L. Barrett, J. Chen, W.T. Elkington, Ejiro Emorhokpor, A. Gupta, C.J. Johnson, R.H. Hopkins, Charles Martin, Thomas Kerr, E. Semenas, Andrew E. Souzis, C.D. Tanner, Murugesu Yoganathan, Ilya Zwieback
75