Experimental Research on Buckling of Nano-Thin Film under Impact Load

Article Preview

Abstract:

The experiments focused on thin film buckling under impact load had been completed. The axial impact experiments were done to different films on the PMMA substrate with the drop hammer device, the buckling images of the film surface were recorded after impact, and the problem of stress release was studied. It was found that buckle’s initiation and propagation were influenced by the materials of thin films and the impact times, and meanwhile buckle’s local distribution phenomenon was also found.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

1262-1265

Citation:

Online since:

October 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] A. R. Shugurov, A. V. Panin: Mechanisms of periodic deformation of the film-substrate system under compressive stress [J], Physical Mesomechanics, Vol. 13(2010), pp.79-87.

DOI: 10.1016/j.physme.2010.03.010

Google Scholar

[2] Edwin P. Chan, Alfred J. Crosby: Fabricating microlens arrays by surface wrinkling [J], Advanced Materials, Vol. 18(2006), pp.3238-3242.

DOI: 10.1002/adma.200601595

Google Scholar

[3] P. Waters, A. A. Volinsky: Stress and moisture effects on thin film buckling delamination [J], Experimental Mechanics, Vol. 47(2007), pp.163-170.

DOI: 10.1007/s11340-006-9346-4

Google Scholar

[4] P. Thota, J. Leifer, S. W. Smith, etal: Pattern evaluation for in-plane displacement measurement of thin films [J], Experimental Mechanics, Vol. 45(2005), pp.18-26.

DOI: 10.1007/bf02428986

Google Scholar

[5] Sangwook Lee, Jungmok Seo, Ja Hoon Koo, etal: Surface deformation of amorphous silicon thin film on elastomeric substrate [J]. Thin Solid Films, Vol. 519(2010), pp.823-828.

DOI: 10.1016/j.tsf.2010.08.140

Google Scholar

[6] Assimina A. Pelegri, HUANG Xiao-qin: Nanoindentation on soft film/hard substrate and hard film/soft substrate material systems with finite element analysis [J]. Composites Science and Technology, Vol. 68(2008), pp.147-155.

DOI: 10.1016/j.compscitech.2007.05.033

Google Scholar

[7] B. Erdem Alaca, John C. Selby, M. T. A. Saif, etal: Biaxial testing of nanoscale films on compliant substrates [J]. Fatigue and Fracture, Vol. 73 (2002), p.2963–2970.

DOI: 10.1063/1.1488685

Google Scholar

[8] M. W. Moon, H. M. Jensen, J. W. Hutchinson, etal: The characterization of telephone cord buckling of compressed thin films on substrate [J]. Journal of the Mechanical and Physics of Solids, Vol. 50 (2002), pp.2355-2377.

DOI: 10.1016/s0022-5096(02)00034-0

Google Scholar