A New-Type Packaging Protection Model of Moulded Pulp on Electron Gun

Abstract:

Electron gun is a kind of fragile and irregular-shape electronic product with multi-material, slender and similarly tube, non-rigid connection structure, which highly demand packaging protection during distribution. In this research work the moulded pulp of inexpensive and environmental-friendly advantages over plastic foams, and excellent machining technique is applied into the transport packaging of electron gun. Firstly, three packaging protection models of moulded pulp (one layer, two layers, and three layers) on electron gun are developed on account of the structural characteristics of electron gun, which have the advantages of compact structure with placement, orientation and fixation, favorable stability, count, and dustproof function for electron gun. Secondly, the package cushioning and vibration-proof performances of these packaging protection models are respectively studied by six groups of drop shock experiments and sine vibration tests of comparison. All results show that, the three packaging protection models of moulded pulp have favorable packaging function, and can provide effective protection for the products of electron gun during storage and transportation.

• Periodical: Applied Mechanics and Materials (Volume 200)
• Pages: 131-135
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.200.131
• Online since: October 2012
• Authors: Yin Guo, Yan Feng Guo, Wen Cai Xu
• Keywords: Electron Gun, Moulded Pulp, Package Cushioning, Packaging Protection Model, Vibration-Proof

References

[1] B.Z. Ye. China Packaging Industry, (2004) No.2, pp.86-88 (in Chinese).

[2] T. Noguchi, M. Miyashita, J. Seto, M. Tan, M. Kawano. Packaging Technology & Science, Vol.10 (1997) No.2, pp.161-168.

[3] X. Ma, A.K. Soh, B Wang. Packaging Technology & Science, Vol.17 (2004) No.3, pp.193-204.

[4] D. W. Geng, G. R. Cao, W.C. Xu, D.J. Wang. Packaging Engineering, (2007) No.4, pp.38-40(in Chinese).

[5] H. W. Ji, H. W. Wang, J. L. Chen. International Conference on Experimental Mechanics 2008, ICEM 2008.

[6] D. G. Eagleton, J.A. Marcondes. Packaging Technology & Science, Vol.7(1994) No.1, pp.65-72.

[7] J. A. Marcondes. Packaging Technology & Science, Vol.11 (1998) No.1, pp.38-43.

[8] J. Hoffman. Packaging Technology & Science, Vol.13(2000)No.5, pp.21l-220.

[9] Y. Fu, Y. M. Yang. Packaging and Food Machinery, (2007) No.1, pp.22-25 (in Chinese).

[10] S. P. Gurav, A. Bereznitski, A. Heidweiller, P.V. Kandachar. Composites Science and Technology, Vol.63 (2003) No.9, p.1325–1334.

DOI: 10.1016/s0266-3538(03)00104-0

[11] J. Han, J. Yu, B. Yang. Packaging Engineering, (2009) No.2, pp.44-45 (in Chinese).