Design on UHV System with TSP

Abstract:

A UHV(ultra-high vacuum) system, which used as deposition equipment with the assistance of high and low vacuum measuring instruments and other accessories, was designed in this paper. A CMP (composite molecular pump) in parallel with TSP (titanium sublimation pump) as the main pump and a rotary-vane pump as the backing pump were designed in this system. After a CMP with displacement 2300l/s was chosen as the one of the main pumps, the total flow conductance between the outlet of vacuum chamber and the CMP was 1344l/s. The rough pump-down time was approximate 5 min by using a rotary-vane pump with pumping speeds 15l/s. In order to ensure the normal operation of the main pumps, a water chilling unit was designed in the system, which can achieve limiting vacuum of 5×10^-6Pa in the vacuum chamber of 0.2 m³.

• Periodical: Applied Mechanics and Materials (Volume 310)
• Pages: 319-322
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.310.319
• Online since: February 2013
• Authors: Jin Hua Zheng, Cong Hui Li, Chong Zhang, Yun Feng Chao
• Keywords: Calculation, Selection, Structural Design, Vacuum System

References

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