Design of Equivalent Sampling Based on Printed Circuit Board Suited for Power Communication System

Chuan Liu; Zhi Chao Huang; Peng Wu; Lei Chen; Wei Wang

doi:10.4028/www.scientific.net/AMM.333-335.465

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 333-335Design of Equivalent Sampling Based on Printed...

Design of Equivalent Sampling Based on Printed Circuit Board Suited for Power Communication System

Abstract:

Many applications in Power communication system have a demand of adjustable transmission time delay of high-speed signal. In sequential logic circuit, the control of transmission time delay of high-speed signal can effectively improve the accuracy of clock sampling, as a result, satisfy the constraints between clock signal and periodic data. A method of equivalent sampling based on printed circuit board (PCB) is provided in the article, it realizes equivalent sampling of the data by fixing a group of clock signal delay, thus, increase the accuracy of sampling.

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Periodical:

Applied Mechanics and Materials (Volumes 333-335)

Pages:

465-471

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.333-335.465

Citation:

Cite this paper

Online since:

July 2013

Authors:

Chuan Liu*, Zhi Chao Huang, Peng Wu, Lei Chen, Wei Wang

Keywords:

Approximate Shielding Structure, Equivalent Sampling, Propagation Delay, Simulation, Smart Grid (SG)

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* - Corresponding Author

References

[1] Liao Weiping, An Qi, Liao Juanjuan. Design of equivalent sampling circuit based on DSP. Nuclear Electronics & Detection Technology, 2000, 20(6).

Google Scholar

[2] SGCC. Report on the 12th Five-Year Program of Telecommunication Technology for Electric Power System[R]. (2010).

Google Scholar

[3] Xie Kai, Liu Yongqi, Zhu Zhizhong, etc. Smart Grid for the future[J]. China Electric Power, 2008, 41(6).

Google Scholar

[4] DU X W, Ye Q. Review of smart grid and its development prospect in Sichuan[A]. Proceedings of 2010 Asia-Pacific Power and Energy Engineering Conference[C]. Chengdu: (2010).

DOI: 10.1109/appeec.2010.5448788

Google Scholar

[5] SGCC. Report on overall report on SGCC intellectual-lization[R]. (2009).

Google Scholar

[6] PCB Design for Real World EMI Control, Archambeault. B , The Netherlands Kluwer Academic Publishers, (2002).

Google Scholar

[7] Signal and Power Integrity in Digital Systems, Buchanan J.E. , McGraw-Hill Book Company, (1995).

Google Scholar

[8] T. Hentschel, M. Henker, and G.P. Fettweis, Sample Rate Conversion in Software Radio Terminals[J]. ACTS Mobile Commun, Sorrento, Italy, June (1999).

Google Scholar

[9] Vaughan, R.G. Scott, N.L. White, and D. Red, The theory of band-pass sampling. IEEE Trans. Signal Processing, vol. 39, pp.1973-1984. Sept. (1991).

DOI: 10.1109/78.134430

Google Scholar

[10] Monhammad Maymandi-Nejad. A digitally programmable delay element: design and analysis. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2003, 11(5).

DOI: 10.1109/tvlsi.2003.810787

Google Scholar

[11] Erdem Matoglu, Nan Pham. Statistical signal integrity analysis and diagnosis methodology for high-speed systems. IEEE Transaction on Advanced Packaging. Vol. 27. NO. 4. Nov. (2004).

DOI: 10.1109/tadvp.2004.831856

Google Scholar

[12] Allegro PCB Layout System. Concept HDL Front-to-Back China_support @ cadence. com , (2004).

Google Scholar