The Lapping Experimental Research Based on Multi-Unit-Lapping Plate

Abstract:

A new process method called multi-unit-lapping plate process is proposed in this paper. This technique could reduce change of cutting depth owing to difference of grain size and protrusion height of surface abrasive of grinding plate, and near equal-cutting-depth processing is realized. For characteristics and machining performance of multi-unit-lapping, this paper reports the following studies: A new experiment was carried out with the optimal parameters and compared with the traditional plate, under the same processing conditions. The results showed that the abrasive grains cutting depth changed obviously with multi-unit-lapping plate.

• Periodical: Applied Mechanics and Materials (Volumes 37-38)
• Pages: 1493-1496
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.37-38.1493
• Online since: November 2010
• Authors: Wei Hang, Fan Jiang, Zhao Zhong Zhou, Yong Dai
• Keywords: Cutting Depth, Lapping, Multi-Cell-Disc, Size Sensitivity

References

[1] S. Chidambaram, Z.J. Pei and S. Kassir: International Journal of Machine Tools & Manufacture, Vol. 43 (2003) No. 15, pp.1595-1602.

DOI: 10.1016/s0890-6955(03)00187-1

[2] J.D. Yang, X.H. Wen, Y.Q. Zhu and L.J. Wang: Chinese Journal of Mechanical Engineering, (1997) No. 2, pp.101-105.

[3] C.L. Tian, H.Y. Yang, J.F. Fan and H.W. Zhou: Journal of Changchun Institute of Optics and Fine Mechanics, Vol. 28 (2005) No. 4, pp.19-21.

[4] R. Komanduri, D.A. Lucca and Y. Tani: Technological Advances in Fine Abrasive Processes. Annals of the CIRP, Vol. 46(1997) No. 2, pp.545-596.

DOI: 10.1016/s0007-8506(07)60880-4

[5] Y. Ahn, J.Y. Yoon, C.W. Baek and Y.K. Kim: Wear, Vol. 25 7(2004), pp.785-789.