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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 419Research Progress of the Preparation and...

Research Progress of the Preparation and Application of Low Dielectric Materials

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Abstract:

This paper is about the preparation of polymer/hollow silica spheres composites with outstanding performances such as high thermal conductivity, low dielectric constant, low dielectric loss, thermal stability ,etc. And the obtained composites are mainly used in high-frequency circuit substrate, packaging materials and connector materials and so on. Research the preparation technology of a new high-stability low-loss dielectric polymer nano-composite materials, get the experience of design and characterization of materials and explore the law of structure and dielectric properties of materials, it is great value for the development of the new polymer materials and new products in electronic information industry.

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Periodical:

Applied Mechanics and Materials (Volume 419)

Pages:

401-406

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.419.401

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Cite this paper

Online since:

October 2013

Authors:

Ping Wang, Li Hua Cheng, Chao Lin Liang, Jian Qing Zhao, Zhi Jie Jiang

Keywords:

Application, Composite, Low Dielectricmaterials, Low Loss

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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