Development of Release Film Automatic Adhesion Machine for Production of Flexible Printed Circuit Board

Abstract:

Industrial areas using FPCB are broadening from simple conection for bending of rigid PCB to main component of elecronic equipment. Fume is generated by melting of adhesion material during the hot press process for manufacturing of FPCB. Release film sheet is used for elemination of gas and absorption of shock in the hot press process. In this paper, release film automatic adhesion machine for hot press process is developed, and ultrasonic welding condition is proposed for optimization of adhesion strength between release films. The performance test of developed machine is conducted.

• Periodical: Applied Mechanics and Materials (Volumes 446-447)
• Pages: 892-895
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.446-447.892
• Online since: November 2013
• Authors: Myung Jin Chung, Dong Hyuk Cha
• Keywords: Adhesion, Automatic, Flexible Printed Circuit Board, Machine, Release Film, Ultrasonic Welding

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