Effect of Density and Ambient Temperature on Coefficient of Thermal Conductivity of Heat-Insulated EPS and PU Materials for Food Packaging

Hai Yan Song; Xin Xin Cheng; Lei Chu

doi:10.4028/www.scientific.net/AMM.469.152

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 469Effect of Density and Ambient Temperature on...

Effect of Density and Ambient Temperature on Coefficient of Thermal Conductivity of Heat-Insulated EPS and PU Materials for Food Packaging

Abstract:

Coefficient of thermal conductivity is an important index of performance evaluation of heat-insulated material. In order to provide theoretical reference basis for the selection of heat-insulated materials, we test the coefficient of thermal conductivity of polystyrene foamed plastic (EPS) and rigid polyurethane foam plastic (PU) in different densities at different ambient temperatures, and then determine the effect of material density and ambient temperature on the coefficient of thermal conductivity of food insulation packaging materials. According to the national standard GB/T10297-1998(Test method for thermal conductivity of nonmetal solid materials by hot-wire method), we test the coefficient of thermal conductivity of samples in different densities at different ambient temperatures. The result shows that at the same temperature, the coefficient of thermal conductivity increases first and then decrease with the increase of density. In the same density, the coefficient of thermal conductivity increases with the increase of ambient temperature.

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Periodical:

Applied Mechanics and Materials (Volume 469)

Pages:

152-155

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.469.152

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Online since:

November 2013

Authors:

Hai Yan Song*, Xin Xin Cheng, Lei Chu

Keywords:

Ambient Temperature, Coefficient of Thermal Conductivity, Density, Heat-Insulated Material

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* - Corresponding Author

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