An Accurate Physics-Based Method for Calculating DC Inductance of a New Shape Inductor

Abstract:

A new Low interference inductor is presented for wireless transmission in 3D Package. An accurate physics-based method is employed to calculate DC inductance of the new shape on-chip inductors. All inductor size parameters are considered in the method including metal thickness and inter-layer space. Due to its physics-based nature, the proposed method is scalable. The results calculated by the proposed modeling show the new inductor is of lower interference than the common one. The new inductor can transfer more efficiently than the common one.

• Periodical: Applied Mechanics and Materials (Volumes 475-476)
• Pages: 1693-1696
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.475-476.1693
• Online since: December 2013
• Authors: Bao Cun Wang, Guo Yi Yu, Zhao Xia Zheng, Zhang Li, Jian Ming Lei, Zhi Ge Zou Zou, Shi Jun Liu, Xue Cheng Zou*
• Keywords: 3D Package, High Speed Interconnect, Inductive Coupling

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