Fabrication of Plastic Micro Features on Microporous Mold by Hot Embossing

Hang Liu; Hong Hu; Xing Wei Zhang

doi:10.4028/www.scientific.net/AMM.58-60.822

Paper Titles

Design of the High-Precision Signal Generator Based on ARM
p.799

State Feedback Guaranteed Cost Control of Parameter Uncertain Nonlinear System
p.803

Testing Coordination System through a Case Study
p.810

Byproduct Gas Optimal Distribution Model and its Application for Iron and Steel Enterprises
p.816

Fabrication of Plastic Micro Features on Microporous Mold by Hot Embossing
p.822

Design Optimization of Savonius Rotors: An Overview
p.827

Calibration of Probe of Cloud Droplet Based on Forward Scattering
p.834

Application of Isomap Method in Prediction of Protein Quaternary Structure
p.840

Identifying Protein Structural Classes by a Fusion Sequence Encoding Scheme
p.843

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 58-60Fabrication of Plastic Micro Features on...

Fabrication of Plastic Micro Features on Microporous Mold by Hot Embossing

Abstract:

The method of using ultrasonic heating to aid high precision moulding of micro features has been studies. The study developed a method of using ultrasonic vibration to heat the polymer and hot embossing high precision micro features. A commercial ultrasonic welding machine is converted to provide the heating of polymer and mold then into precision micro features for study of ultrasonic heating and the microflow of polymer under ultrasonic agitation. A stainless steel microporous mold of 200µm thick with through holes of 50µm and 200µm in diameter were used. Using a frequency of 35kHz, the microflow behavior of PC (Polycarbonate) and PE (Polyethylene) in the microchannels were investigated. The differing properties of microflow for these two types of polymer give indication on the theoretical and practical agreement on prediction of microflow under ultrasonic energy.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volumes 58-60)

Pages:

822-826

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.58-60.822

Citation:

Cite this paper

Online since:

June 2011

Authors:

Hang Liu, Hong Hu, Xing Wei Zhang

Keywords:

Hot Embossing, Micro-Channel, Micro-Features

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Khuntontong, P, Blaser, T. G. and Schomburg, W.K., in: Electronics Packaging Manufacturing, vol. 32, no. 3, July (2009).

Google Scholar

[2] Roman Truckenmüller, Ralf Ahrens, Yue Cheng, Günther Fischer, Volker Saile, in: Sensors and Actuators A: Physical, Volume 132, Issue 1, 8 November 2006, Pages 385-392.

DOI: 10.1016/j.sna.2006.04.040

Google Scholar

[3] S. Moynihan, R. Van Deun, K. Binnemans, J. Krueger, G. von Papen, A. Kewell, G. Crean, G. Redmond, in: Optical Materials, Volume 29, Issue 12, August 2007, Pages 1798-1808.

DOI: 10.1016/j.optmat.2006.10.010

Google Scholar

[4] Yi Luo, Zongbo Zhang, Xiaodong Wang, Yingsong Zheng, in: Microelectronic Engineering, Volume 87, Issue 11, November 2010, Pages 2429-2436.

Google Scholar

[5] H. Mekaru, O. Nakamura, O. Maruyama, R. Maeda, and T. Hattori, in: Microsyst. Technol., vol. 13, p.385–391, Jan. (2006).

Google Scholar

[6] Hyun Woo Yu, Chi Hoon Lee et al, in: J. Micro/Nanolith. MEMS MOEMS 8(2), 021113 (Apr–Jun 2009).

Google Scholar

[7] A. Benatar, V. E. Raman, and K. N. Satiner, in: Polymer Eng. Sci., vol. 29, no. 23, p.1689–1697, (1989).

Google Scholar

[8] Zong-bo ZHANG1, Yi LUO, in: 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008).

DOI: 10.1109/icept.2008.4606931

Google Scholar